Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121093 | Methods for selectively forming identification mark on semiconductor wafer | Yue-Lin Peng, Cheng-Yi Huang, Fu-Jen Li | 2021-09-14 |
| 11004720 | System and method for ring frame cleaning and inspection | Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Jian-Hung Chen, Meng-Chen Lin +3 more | 2021-05-11 |
| 10991625 | Automated transfer and drying tool for process chamber | Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Yang-Ann Chu | 2021-04-27 |
| 10971386 | Device positioning using sensors | Yan-Han CHEN, Cheng-Kang Hu, Ren-Hau Wu, Cheng-Hung Chen, Feng-Kuang Wu +2 more | 2021-04-06 |
| 10876976 | Apparatus and method for substrate inspection | Bo-Han Shih, Sheng-Hsiang Chuang, Hsu-Shui Liu, Jiun-Rong Pai | 2020-12-29 |
| 10872794 | Automatic in-line inspection system | Chien-Ko Liao, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Ya Hsun Hsueh | 2020-12-22 |
| 10861723 | EFEM robot auto teaching methodology | Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai | 2020-12-08 |
| 10852704 | Semiconductor equipment management method, electronic device, and non-transitory computer readable storage medium | Sing-Tsung Li, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Chien-Ko Liao | 2020-12-01 |
| 10839507 | Defect offset correction | Chien-Ko Liao, Ya Hsun Hsueh, Sheng-Hsiang Chuang, Hsu-Shui Liu, Jiun-Rong Pai | 2020-11-17 |
| 10734206 | Techniques for detecting micro-arcing occurring inside a semiconductor processing chamber | Feng-Kuang Wu, Chih-Kuo Chang, Hsu-Shui Liu, Jiun-Rong Pai, Sing-Tsung Li | 2020-08-04 |
| 10714364 | Apparatus and method for inspecting wafer carriers | Cheng-Kang Hu, Sheng-Hsiang Chuang, Jiun-Rong Pai, Hsu-Shui Liu | 2020-07-14 |
| 10665489 | Integrated chip die carrier exchanger | Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Pin-Yi Hsin, Patrick Lin | 2020-05-26 |
| 10665507 | Automated transfer and drying tool for process chamber | Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Yang-Ann Chu | 2020-05-26 |
| 10643951 | Mini identification mark in die-less region of semiconductor wafer | Yue-Lin Peng, Cheng-Yi Huang, Fu-Jen Li | 2020-05-05 |
| 10559453 | Techniques for detecting micro-arcing occurring inside a semiconductor processing chamber | Feng-Kuang Wu, Chih-Kuo Chang, Hsu-Shui Liu, Jiun-Rong Pai, Sing-Tsung Li | 2020-02-11 |
| 10490463 | Automated inspection tool | Chia-Han Lin, Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang +9 more | 2019-11-26 |
| 10283388 | Detaping machine and detaping method | Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Wen-Chin Kan, Yang-Ann Chu | 2019-05-07 |
| 10170287 | Techniques for detecting micro-arcing occurring inside a semiconductor processing chamber | Feng-Kuang Wu, Chih-Kuo Chang, Hsu-Shui Liu, Jiun-Rong Pai, Sing-Tsung Li | 2019-01-01 |
| 9852936 | Load port and method for loading and unloading cassette | Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai | 2017-12-26 |
| 9786530 | Wafer transfer method and system | Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai | 2017-10-10 |
| 9460957 | Method and structure for nitrogen-doped shallow-trench isolation dielectric | Shing-Long Lee, Yi-Chieh Wang, Chung-Han Lin, Kuang-Jung Peng, Yun-Min Chang | 2016-10-04 |