Issued Patents All Time
Showing 101–125 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8782588 | Multiple level spine routing | Fong-Yuan Chang, Wei-Shun Chuang, Hsian-Ho Chang, Ruey-Shi Rau | 2014-07-15 |
| 8683417 | Multiple level spine routing | Fong-Yuan Chang, Wei-Shun Chuang, Hsian-Ho Chang, Ruey-Shi Rau | 2014-03-25 |
| 8407647 | Systems and methods for designing and making integrated circuits with consideration of wiring demand ratio | Fong-Yuan Chang, Tung-Chieh Chen, Ren-Song Tsay, Wai-Kei Mak | 2013-03-26 |
| 7667303 | Multi-chip package | Jen-Te Tseng | 2010-02-23 |
| 7026721 | Method of improving copper pad adhesion | — | 2006-04-11 |
| 6872627 | Selective formation of metal gate for dual gate oxide application | Minghsing Tsai | 2005-03-29 |
| 6865948 | Method of wafer edge damage inspection | — | 2005-03-15 |
| 6818533 | Epitaxial plasma enhanced chemical vapor deposition (PECVD) method providing epitaxial layer with attenuated defects | Shun-Long Chen, Hungtse Lin, Ming-Shing Tsai, Lan-Chieh Shih | 2004-11-16 |
| 6730580 | Silicon substrate wafer fabrication method employing halogen gettering material and/or plasma annealing | Shun-Long Chen, Hungtse Lin, Naite Chen | 2004-05-04 |
| 6660577 | Method for fabricating metal gates in deep sub-micron devices | Ming-Hsing Tsai | 2003-12-09 |
| 6573187 | Method of forming dual damascene structure | Ming-Hsing Tsai | 2003-06-03 |
| 6560862 | Modified pad for copper/low-k | Shun-Long Chen, Hungtse Lin | 2003-05-13 |
| 6518166 | Liquid phase deposition of a silicon oxide layer for use as a liner on the surface of a dual damascene opening in a low dielectric constant layer | Shun-Long Chen, Hungtse Lin, Frank Hsu, Tsu Shih | 2003-02-11 |
| 6489684 | Reduction of electromigration in dual damascene connector | Tsu Shi, Ming-Hsing Tsai | 2002-12-03 |
| 6466427 | Microelectronic capacitor structure compatible with copper containing microelectronic conductor layer processing | — | 2002-10-15 |
| 6420258 | Selective growth of copper for advanced metallization | Ming-Hsing Tsai | 2002-07-16 |
| 6399486 | Method of improved copper gap fill | Ming-Hsing Tsai | 2002-06-04 |
| 6384442 | Fabrication process for metal-insulator-metal capacitor with low gate resistance | — | 2002-05-07 |
| 6350667 | Method of improving pad metal adhesion | Fan Yang | 2002-02-26 |
| 6313003 | Fabrication process for metal-insulator-metal capacitor with low gate resistance | — | 2001-11-06 |
| 6303459 | Integration process for Al pad | — | 2001-10-16 |
| 6303498 | Method for preventing seed layer oxidation for high aspect gap fill | Ming-Hsing Tsai | 2001-10-16 |
| 6235637 | Method for marking a wafer without inducing flat edge particle problem | Ming-Hsing Tsai | 2001-05-22 |
| 6191023 | Method of improving copper pad adhesion | — | 2001-02-20 |
| 5961718 | Process for selectively depositing diamond films | Chia-Fu Chen, Tsao-Ming Hong | 1999-10-05 |