Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269627 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao +3 more | 2019-04-23 |
| 10199500 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo +1 more | 2019-02-05 |
| 10163691 | Low-K dielectric interconnect systems | Chia-Cheng Chou, Chung-Chi Ko | 2018-12-25 |
| 9842804 | Methods for reducing dual damascene distortion | Chao-Chun Wang, Chung-Chi Ko | 2017-12-12 |
| 9768061 | Low-k dielectric interconnect systems | Chia-Cheng Chou, Chung-Chi Ko | 2017-09-19 |
| 9754822 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao +3 more | 2017-09-05 |
| 9748134 | Method of making interconnect structure | Yu-Yun Peng, Chia-Cheng Chou, Joung-Wei Liou | 2017-08-29 |
| 9373581 | Interconnect structure and method for forming the same | Joung-Wei Liou, Chih-Hung Sun, Chia-Cheng Chou, Kuang-Yuan Hsu | 2016-06-21 |
| 9269614 | Method of forming semiconductor device using remote plasma treatment | Hui-Chun Yang, Chih-Hung Sun, Joung-Wei Liou | 2016-02-23 |
| 9257331 | Method of making interconnect structure | Yu-Yun Peng, Chia-Cheng Chou, Joung-Wei Liou | 2016-02-09 |
| 9236294 | Method for forming semiconductor device structure | Chia-Cheng Chou, Chung-Chi Ko, Chih-Hung Sun, Kuang-Yuan Hsu, Joung-Wei Liou +1 more | 2016-01-12 |
| 9130017 | Methods for forming interconnect structures of integrated circuits | Chung-Chi Ko, Keng-Chu Lin | 2015-09-08 |
| 9093265 | High UV curing efficiency for low-k dielectrics | Hui-Chun Yang, Chung-Chi Ko, Kuang-Yuan Hsu | 2015-07-28 |
| 8993442 | Interconnect structure and method for forming the same | Joung-Wei Liou, Chih-Hung Sun, Chia-Cheng Chou, Kuang-Yuan Hsu | 2015-03-31 |
| 8994178 | Interconnect structure and method for forming the same | Hui-Chun Yang, Chih-Hung Sun, Joung-Wei Liou | 2015-03-31 |
| 8993435 | Low-k Cu barriers in damascene interconnect structures | Kuan-Chen Wang, Chung-Chi Ko, Keng-Chu Lin, Shwang-Ming Jeng | 2015-03-31 |
| 8877083 | Surface treatment in the formation of interconnect structure | Chia-Cheng Chou, Mei-Ling Chen, Hui-Chun Yang, Joung-Wei Liou, Shwang-Ming Jeng | 2014-11-04 |
| 8853831 | Interconnect structure and method for forming the same | Yu-Yun Peng, Chia-Cheng Chou, Joung-Wei Liou | 2014-10-07 |
| 8470708 | Double patterning strategy for contact hole and trench in photolithography | Kuan-Chen Wang, Chung-Chi Ko, Keng-Chu Lin, Tai-Yen Peng, Wen-Kuo Hsieh +1 more | 2013-06-25 |
| 7400312 | Common voltage adjustment circuit and liquid crystal display panel utilizing the same | Chi-Mao Hung | 2008-07-15 |