Issued Patents All Time
Showing 76–100 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094556 | Method of manufacturing semiconductor devices using directional process | Ya-Wen Yeh, Yu-Tien Shen, Shih-Chun Huang, Po-Chin Chang, Wei-Liang Lin +4 more | 2021-08-17 |
| 11056393 | Method for FinFET fabrication and structure thereof | Han-Yu Lin, Yi-Ruei Jhan, Fang-Wei Lee, Tze-Chung Lin, Chao-Hsien Huang +2 more | 2021-07-06 |
| 11043381 | Directional patterning method | Po-Chin Chang, Li-Te Lin, Ru-Gun Liu, Wei-Liang Lin, Yu-Tien Shen +1 more | 2021-06-22 |
| 11024721 | Semiconductor device and manufacturing method thereof | Zhi-Qiang WU, Kuo-An Liu, Chan-Lon Yang, Bharath Kumar Pulicherla, Li-Te Lin +2 more | 2021-06-01 |
| 10998421 | Reducing pattern loading in the etch-back of metal gate | Po-Chin Chang, Wei-Hao Wu, Li-Te Lin | 2021-05-04 |
| 10957779 | Gate etch back with reduced loading effect | Yi-Chen Lo, Jung-Hao Chang, Li-Te Lin | 2021-03-23 |
| 10950434 | Methods of reducing gate spacer loss during semiconductor manufacturing | Yi-Ruei Jhan, Han-Yu Lin, Li-Te Lin | 2021-03-16 |
| 10847633 | Method for forming semiconductor device | Yi-Ruei Jhan, Yi-Lun Chen, Fang-Wei Lee, Han-Yu Lin, Li-Te Lin | 2020-11-24 |
| 10790195 | Elongated pattern and formation thereof | Po-Chin Chang, Li-Te Lin | 2020-09-29 |
| 10777455 | Multi-etching process for forming via opening in semiconductor device structure | Chun-Jui Huang, Li-Te Lin | 2020-09-15 |
| 10755968 | Method of forming semiconductor structure having layer with re-entrant profile | Yi-Shan Chen, Chan Syun David Yang, Li-Te Lin | 2020-08-25 |
| 10741671 | Method for manufacturing semiconductor device | Yi-Chen Lo, Li-Te Lin | 2020-08-11 |
| 10707081 | Fine line patterning methods | Shih-Chun Huang, Chiu-Hsiang Chen, Ya-Wen Yeh, Yu-Tien Shen, Po-Chin Chang +7 more | 2020-07-07 |
| 10692760 | Semiconductor structure and method for manufacturing the same | Hung-Chang Sun, Po-Chin Chang, Akira Mineji, Zi-Wei Fang | 2020-06-23 |
| 10189143 | Polishing pad, method for manufacturing polishing pad, and polishing method | Chi-Hao Huang, Hsuan-Pang Liu, Yuan-Chun Sie, Cheng-Chung Chien | 2019-01-29 |
| 10157773 | Semiconductor structure having layer with re-entrant profile and method of forming the same | Yi-Shan Chen, Chan Syun David Yang, Li-Te Lin | 2018-12-18 |
| 9666461 | Semiconductor process and semiconductor processing device using the same | Yii-Cheng Lin, Chih-Ming Sun | 2017-05-30 |
| 8992857 | Mixing device and mixing method | David A. Mantell, Peter M. Gulvin, Andrew W. Hays | 2015-03-31 |
| 8613397 | Transducer interconnect with conductive films | Bradley J. Gerner, John R. Andrews | 2013-12-24 |
| 8563115 | Protective coatings for solid inkjet applications | Liang-Bih Lin | 2013-10-22 |
| 8562114 | Inkjet ejector having an improved filter | Bradley J. Gerner, John R. Andrews, Bryan R. Dolan, Antonio DeCrescentis | 2013-10-22 |
| 8565659 | Fuser member and method of manufacture | George Cunha Cardoso, Anthony S. Condello, Jason M. LeFevre, Richard W. Seyfried, Grace T. Brewington +4 more | 2013-10-22 |
| 8491747 | Method for facilitating assembly of a printhead having a polymer layer | Bryan R. Dolan, John R. Andrews, Bradley J. Gerner, Antonio DeCrescentis | 2013-07-23 |
| 8408683 | Method of removing thermoset polymer from piezoelectric transducers in a print head | Bradley J. Gerner, John R. Andrews, Bryan R. Dolan | 2013-04-02 |
| 8367020 | Hydroxyl group-containing solid inks | — | 2013-02-05 |