Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12396096 | Circuit board device | Chin-Hsun Wang, Ruey-Beei Wu, Wei-Yu Liao, Ching-Sheng Chen, Chi-Min Chang | 2025-08-19 |
| 12315981 | Transmission line device compriing first and second conductive lines on one level separated from a third conductive line on another level by an intervening ground layer | Yu-Kuang Wang, Ruey-Beei Wu, Ching-Sheng Chen, Wei-Yu Liao, Chi-Min Chang | 2025-05-27 |
| 12133323 | Transmission device for suppressing glass fiber effect | Chin-Hsun Wang, Ruey-Beei Wu, Ching-Sheng Chen, Wei-Yu Liao, Chi-Min Chang | 2024-10-29 |
| 11942367 | Semiconductor device and method of manufacture | Chan Syun David Yang, Li-Te Lin | 2024-03-26 |
| 11581222 | Via in semiconductor device structure | Li-Te Lin, Pinyen Lin | 2023-02-14 |
| 10861745 | Semiconductor device and method of manufacture | Chan Syun David Yang, Li-Te Lin | 2020-12-08 |
| 10777455 | Multi-etching process for forming via opening in semiconductor device structure | Li-Te Lin, Pinyen Lin | 2020-09-15 |