Issued Patents All Time
Showing 76–79 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8421073 | Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC) | Hung-Chih Lin, Ching-Nen Peng, Hao Chen | 2013-04-16 |
| 8400178 | Method and system of testing a semiconductor device | Han-Ping Pu | 2013-03-19 |
| 8146245 | Method for assembling a wafer level test probe card | Clinton Chao, Fei-Chieh Yang, Chun-Hsing Chen, Sheng-Hsi Huang, Ming-Cheng Hsu | 2012-04-03 |
| 7750651 | Wafer level test probe card | Clinton Chao, Fei-Chieh Yang, Chun-Hsing Chen, Sheng-Hsi Huang, Ming-Cheng Hsu | 2010-07-06 |