Issued Patents All Time
Showing 126–131 of 131 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6743732 | Organic low K dielectric etch with NH3 chemistry | Li-Chih Chao, Chia-Shiung Tsai | 2004-06-01 |
| 6720256 | Method of dual damascene patterning | Tsang-Jiuh Wu, Li-Chih Chao | 2004-04-13 |
| 6551938 | N2/H2 chemistry for dry development in top surface imaging technology | Tsang-Jiuh Wu, Li-Chih Chao | 2003-04-22 |
| 6495469 | High selectivity, low etch depth micro-loading process for non stop layer damascene etch | Jiing-Feng Yang, Li-Chih Chao | 2002-12-17 |
| 6407002 | Partial resist free approach in contact etch to improve W-filling | Yuan-Hung Chiu, Ming-Huan Tsai, Hun-Jan Tao | 2002-06-18 |
| 6376366 | Partial hard mask open process for hard mask dual damascene etch | Li-Chih Chao | 2002-04-23 |