Issued Patents All Time
Showing 76–99 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6287939 | Method for fabricating a shallow trench isolation which is not susceptible to buried contact trench formation | Tse-Liang Ying, Wen-Chuan Chiang | 2001-09-11 |
| 6278352 | High efficiency thin film inductor | Jin-Yuan Lee, Tse-Liang Ying | 2001-08-21 |
| 6271570 | Trench-free buried contact | Yean-Kuen Fang, Mong-Song Liang, Jhon Jhy Liaw, Cheng-Ming Wu, Dun-Nian Yaung | 2001-08-07 |
| 6248673 | Hydrogen thermal annealing method for stabilizing microelectronic devices | Ji-Chung Huang, Jang-Cheng Hsieh, Chung-Cheng Wu | 2001-06-19 |
| 6214715 | Method for fabricating a self aligned contact which eliminates the key hole problem using a two step spacer deposition | Tse-Liang Ying, Wen-Chuan Chiang | 2001-04-10 |
| 6194234 | Method to evaluate hemisperical grain (HSG) polysilicon surface | Tse-Liang Ying, Wen-Chuan Chiang, Yu-Hua Lee | 2001-02-27 |
| 6174802 | Method for fabricating a self aligned contact which eliminates the key hole problem using a two step contact deposition | Tse-Liang Ying, Wen-Chuan Chiang, Min-Hsiung Chiang | 2001-01-16 |
| 6165880 | Double spacer technology for making self-aligned contacts (SAC) on semiconductor integrated circuits | Dun-Nian Yaung, Shou-Gwo Wuu, Li-Chih Chao | 2000-12-26 |
| 6162686 | Method for forming a fuse in integrated circuit application | Tse-Liang Ying, Yu-Hua Lee, Ming Li | 2000-12-19 |
| 6121073 | Method for making a fuse structure for improved repaired yields on semiconductor memory devices | Tse-Liang Ying, Cheng-Yeh Shih, Yu-Hua Lee, Cheng-Ming Wu | 2000-09-19 |
| 6110822 | Method for forming a polysilicon-interconnect contact in a TFT-SRAM | Yean-Kuen Fang, Mong-Song Liang, Dun-Nian Yaung | 2000-08-29 |
| 6103455 | Method to form a recess free deep contact | Wen-Chuan Chiang, Cheng-Ming Wu, Yu-Hua Lee | 2000-08-15 |
| 6093619 | Method to form trench-free buried contact in process with STI technology | Tse-Liang Ying, Chia-Shiung Tsai | 2000-07-25 |
| 6080637 | Shallow trench isolation technology to eliminate a kink effect | Tse-Liang Ying, Wen-Chuan Chiang, Cheng-Yeh Shih | 2000-06-27 |
| 6080647 | Process to form a trench-free buried contact | Yean-Kuen Fang, Mong-Song Liang, Jhon Jhy Liaw, Cheng-Ming Wu, Dun-Nian Yaung | 2000-06-27 |
| 6078087 | SRAM memory device with improved performance | Yean-Kuen Fang, Mong-Song Liang, Cheng-Yeh Shih, Dun-Nian Yaung | 2000-06-20 |
| 6046062 | Method to monitor the kink effect | Chuan-Jane Chao, Kuei-Ying Lee, Yean-Kuen Fang | 2000-04-04 |
| 6037222 | Method for fabricating a dual-gate dielectric module for memory embedded logic using salicide technology and polycide technology | Tse-Liang Ying, Chen-Jong Wang, Jenn Ming Huang | 2000-03-14 |
| 6033985 | Contact process interconnect poly-crystal silicon layer in thin film SRAM | Yean-Kuen Fang, Chung-Yao Chen | 2000-03-07 |
| 6027969 | Capacitor structure for a dynamic random access memory cell | James Wu | 2000-02-22 |
| 6015734 | Method for improving the yield on dynamic random access memory (DRAM) with cylindrical capacitor structures | Yu-Hua Lee, Cheng-Ming Wu | 2000-01-18 |
| 5998269 | Technology for high performance buried contact and tungsten polycide gate integration | Shou-Gwo Wuu, Jenn Ming Huang, Dun-Nian Yaung | 1999-12-07 |
| 5953606 | Method for manufacturing a TFT SRAM memory device with improved performance | Yean-Kuen Fang, Mong-Song Liang, Cheng-Yeh Shih, Dun-Nian Yaung | 1999-09-14 |
| 4688402 | Knitting machine transmission mechanism assembly | — | 1987-08-25 |