Issued Patents All Time
Showing 26–50 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854899 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Chao-Cheng Chen, Chih-Han Lin, Chen-Ping Chen, Ming-Ching Chang +1 more | 2023-12-26 |
| 11855179 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Ya-Yi Tsai, Shu-Uei Jang, Chih-Han Lin, Shu-Yuan Ku | 2023-12-26 |
| 11856744 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Chih-Han Lin | 2023-12-26 |
| 11798898 | Package structure | Hsien-Wen Liu, Shin-Puu Jeng | 2023-10-24 |
| 11756928 | Multi-chip packages | Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng | 2023-09-12 |
| 11721693 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Yu-Shan Cheng, Ming-Ching Chang | 2023-08-08 |
| 11688643 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Chih-Han Lin | 2023-06-27 |
| 11652159 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Chih-Han Lin | 2023-05-16 |
| 11563105 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Yu-Shan Cheng, Chao-Cheng Chen | 2023-01-24 |
| 11552195 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Li-Jung Kuo, Chen-Ping Chen, Ming-Ching Chang | 2023-01-10 |
| 11522073 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Chih-Han Lin, Chen-Ping Chen, Kuei-Yu Kao | 2022-12-06 |
| 11437327 | Integrated fan-out packaging | Han-Ping Pu | 2022-09-06 |
| 11387341 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Chih-Han Lin | 2022-07-12 |
| 11342306 | Multi-chip wafer level packages | Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng | 2022-05-24 |
| 11189596 | Methods of forming multi-chip wafer level packages | Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng | 2021-11-30 |
| 11056445 | Package structure with buffer layer sandwiched between encapsulation layer and semiconductor substrate | Hsien-Wen Liu, Shin-Puu Jeng | 2021-07-06 |
| 11050868 | Internet phone system | Yu-Ti Kuo, Wen-Hsieh Hsieh, Chao-Tang Chiu, Chien-Yi Lee, Ching-Jen Wang | 2021-06-29 |
| 10890837 | Structured light projection system | I-Hsin Tung | 2021-01-12 |
| 10867930 | Integrated fan-out packaging | Han-Ping Pu | 2020-12-15 |
| 10797007 | Semiconductor structure and manufacturing method thereof | Hsiu-Mei Yu | 2020-10-06 |
| 10763239 | Multi-chip wafer level packages and methods of forming the same | Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng | 2020-09-01 |
| 10750070 | Light-emitting diode and surveillance camera device using the same | I-Hsin Tung | 2020-08-18 |
| 10529671 | Package structure and method for forming the same | Hsien-Wen Liu, Shin-Puu Jeng | 2020-01-07 |
| 10397385 | Internet phone system | Yu-Ti Kuo, Wen-Hsieh Hsieh, Chao-Tang Chiu, Chien-Yi Lee, Ching-Jen Wang | 2019-08-27 |
| 10269720 | Integrated fan-out packaging | Han-Ping Pu | 2019-04-23 |