Issued Patents All Time
Showing 26–50 of 263 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255070 | Semiconductor devices and methods of manufacturing | Min-Hsuan Lu, Kan-Ju Lin, Lin-Yu Huang, Sheng-Tsung Wang, Hung-Yi Huang +2 more | 2025-03-18 |
| 12237218 | Method of fabricating contact structure | Chang-Ting Chung, Shih-Wei Yeh, Kai-Chieh Yang, Yu-Ting Wen, Yu-Chen Ko +5 more | 2025-02-25 |
| 12218012 | Method of manufacturing semiconductor devices with multiple silicide regions | Wei-Yip Loh, Yan-Ming Tsai, Hung-Hsu Chen, Sheng-Hsuan Lin | 2025-02-04 |
| 12216978 | Routing structure of semiconductor device and forming method thereof | Anurag Verma, Meng-Kai Hsu, Sang-Chi Huang, Wei Ling Chang, Hui-Zhong Zhuang | 2025-02-04 |
| 12188042 | Electroporation devices and methods of cell transfection | — | 2025-01-07 |
| 12188982 | Test method for delay circuit and test circuitry | Kuo-Wei Chi, Chun-Chi Yu | 2025-01-07 |
| 12173279 | Micro flow-through electroporation devices and methods of cell transfection | — | 2024-12-24 |
| 12166078 | Contact structure for semiconductor device and method | Yan-Ming Tsai, Ming-Hsing Tsai, Sheng-Hsuan Lin, Hung-Hsu Chen, Wei-Yip Loh | 2024-12-10 |
| 12158585 | Wearable display device and projection device | Chin-Sheng Chao | 2024-12-03 |
| 12127147 | Synchronization correction method, master device and slave device | Yu-Min Wang | 2024-10-22 |
| 12125802 | Chip and memory | — | 2024-10-22 |
| 12119315 | Chip bonding method and semiconductor chip structure | — | 2024-10-15 |
| 12107086 | Field effect transistor contact with reduced contact resistance | Su-Hao Liu, Yan-Ming Tsai, Chung-Ting Wei, Ziwei Fang, Chien-Hao Chen +1 more | 2024-10-01 |
| 12089512 | Semiconductor structure | Shih-Wei Su, Da-Jun Lin, Bin-Siang Tsai, Ting-An Chien | 2024-09-10 |
| 12088359 | Receiver of communication system and eye diagram measuring method | Shih-Chang Chen, Chun-Chi Yu | 2024-09-10 |
| 12087642 | Selective dual silicide formation | Wei-Yip Loh, Yan-Ming Tsai, Yi-Ning Tai, Raghunath PUTIKAM, Hung-Yi Huang +1 more | 2024-09-10 |
| 12086206 | Matrix multiplier and operation method thereof | Jian Chen, YuShan Ruan, Youn-Long Lin | 2024-09-10 |
| 12057397 | Capping layer for liner-free conductive structures | Shuen-Shin Liang, Chun-I Tsai, Chun-Hsien Huang, Hung-Yi Huang, Keng-Chu Lin +4 more | 2024-08-06 |
| 12046510 | Conductive feature formation and structure | Wei-Yip Loh, Hong-Mao Lee, Chun-Hsien Huang, Yu-Ming Huang, Yan-Ming Tsai +4 more | 2024-07-23 |
| 12015076 | HEMT and method of fabricating the same | Yao-Hsien Chung, Shih-Wei Su, Hao-Hsuan Chang, Da-Jun Lin, Ting-An Chien +1 more | 2024-06-18 |
| 12009200 | Treatment for adhesion improvement | Ching-Yi Chen, Wei-Yip Loh, Hung-Hsu Chen | 2024-06-11 |
| 12009056 | Data transmission apparatus and method having clock gating mechanism | Fu-Chin Tsai, Ger-Chih Chou, Chun-Chi Yu, Shih-Han Lin | 2024-06-11 |
| 12006507 | Electroporation with active compensation | Jon Thomas Van Lew, Artin MEHRABI | 2024-06-11 |
| 12002712 | Phase control in contact formation | Chun-Hsien Huang, I-Li Chen, Pin-Wen Chen, Yuan-Chen Hsu, Wei-Jung Lin +1 more | 2024-06-04 |
| 11990390 | Semiconductor structure | Ping-Heng Wu, Hailin Wang | 2024-05-21 |