Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406863 | Wafer separation apparatus and method, and method for manufacturing silicon wafer | Tsukasa Yoshihara, Yasunori Yoshioka, Kawahito Shinichi, Sumihisa Masuda | 2025-09-02 |
| 11456168 | Method of lapping semiconductor wafer and semiconductor wafer | Daisuke Hashimoto, Satoshi Matagawa | 2022-09-27 |
| 9881783 | Method for processing semiconductor wafer | Toshiyuki Tanaka, Yasuyuki Hashimoto | 2018-01-30 |
| 9550264 | Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer | Yuichi Kakizono, Yoshiaki Kurosawa | 2017-01-24 |
| 9324558 | Machining process for semiconductor wafer | Toshiyuki Tanaka, Yasuyuki Hashimoto | 2016-04-26 |
| 9017145 | Polishing solution distribution apparatus and polishing apparatus having the same | Yoshiaki Kurosawa, Yuichi Kakizono | 2015-04-28 |
| 8759229 | Method for manufacturing epitaxial wafer | Sakae Koyata, Kazushige Takaishi, Katsuhiko Murayama, Takeo Katoh | 2014-06-24 |
| 8466071 | Method for etching single wafer | Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh | 2013-06-18 |
| 8092277 | Method of grinding semiconductor wafers, grinding surface plate, and grinding device | Yasunori Yamada, Yuichi Kakizono | 2012-01-10 |
| 8066896 | Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer | Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh | 2011-11-29 |
| 7955982 | Method for smoothing wafer surface and apparatus used therefor | Takeo Katoh, Katsuhiko Murayama, Sakae Koyata, Kazushige Takaishi | 2011-06-07 |
| 7906438 | Single wafer etching method | Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh | 2011-03-15 |
| 7717768 | Wafer polishing apparatus and method for polishing wafers | Katsuhiko Murayama, Sakae Koyata, Kazushige Takaishi | 2010-05-18 |
| 7648890 | Process for producing silicon wafer | Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh | 2010-01-19 |
| 7601644 | Method for manufacturing silicon wafers | Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh | 2009-10-13 |
| 7488400 | Apparatus for etching wafer by single-wafer process | Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh | 2009-02-10 |
| 7288207 | Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same | Sakae Koyata, Yuichi Kakizono, Katsuhiko Murayama | 2007-10-30 |
| 6969302 | Semiconductor wafer grinding method | — | 2005-11-29 |
| 6753256 | Method of manufacturing semiconductor wafer | Tooru Watanabe | 2004-06-22 |
| 6465328 | Semiconductor wafer manufacturing method | Kazunori Onizaki, Sumihisa Masuda | 2002-10-15 |