TH

Tomohiro Hashii

SU Sumco: 17 patents #12 of 464Top 3%
SI Sumitomo Metal Industries: 3 patents #222 of 1,462Top 20%
Overall (All Time): #216,579 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12406863 Wafer separation apparatus and method, and method for manufacturing silicon wafer Tsukasa Yoshihara, Yasunori Yoshioka, Kawahito Shinichi, Sumihisa Masuda 2025-09-02
11456168 Method of lapping semiconductor wafer and semiconductor wafer Daisuke Hashimoto, Satoshi Matagawa 2022-09-27
9881783 Method for processing semiconductor wafer Toshiyuki Tanaka, Yasuyuki Hashimoto 2018-01-30
9550264 Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer Yuichi Kakizono, Yoshiaki Kurosawa 2017-01-24
9324558 Machining process for semiconductor wafer Toshiyuki Tanaka, Yasuyuki Hashimoto 2016-04-26
9017145 Polishing solution distribution apparatus and polishing apparatus having the same Yoshiaki Kurosawa, Yuichi Kakizono 2015-04-28
8759229 Method for manufacturing epitaxial wafer Sakae Koyata, Kazushige Takaishi, Katsuhiko Murayama, Takeo Katoh 2014-06-24
8466071 Method for etching single wafer Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh 2013-06-18
8092277 Method of grinding semiconductor wafers, grinding surface plate, and grinding device Yasunori Yamada, Yuichi Kakizono 2012-01-10
8066896 Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh 2011-11-29
7955982 Method for smoothing wafer surface and apparatus used therefor Takeo Katoh, Katsuhiko Murayama, Sakae Koyata, Kazushige Takaishi 2011-06-07
7906438 Single wafer etching method Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh 2011-03-15
7717768 Wafer polishing apparatus and method for polishing wafers Katsuhiko Murayama, Sakae Koyata, Kazushige Takaishi 2010-05-18
7648890 Process for producing silicon wafer Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh 2010-01-19
7601644 Method for manufacturing silicon wafers Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh 2009-10-13
7488400 Apparatus for etching wafer by single-wafer process Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh 2009-02-10
7288207 Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same Sakae Koyata, Yuichi Kakizono, Katsuhiko Murayama 2007-10-30
6969302 Semiconductor wafer grinding method 2005-11-29
6753256 Method of manufacturing semiconductor wafer Tooru Watanabe 2004-06-22
6465328 Semiconductor wafer manufacturing method Kazunori Onizaki, Sumihisa Masuda 2002-10-15