Tomohiro Hashii — 20 Patents at Sumco

Tomohiro Hashii has been granted 20 US patents while listed as an inventor at Sumco. The first was granted in 2002 and the most recent in September 2025. Tomohiro Hashii ranks #214,803 of 4,157,543 US inventors in our database (top 5.2%). Patent records list Tomohiro Hashii in Tokyo, JP.

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #	Title	Co-Inventors	Date
12406863	Wafer separation apparatus and method, and method for manufacturing silicon wafer	Tsukasa Yoshihara, Yasunori Yoshioka, Kawahito Shinichi, Sumihisa Masuda	2025-09-02
11456168	Method of lapping semiconductor wafer and semiconductor wafer	Daisuke Hashimoto, Satoshi Matagawa	2022-09-27
9881783	Method for processing semiconductor wafer	Toshiyuki Tanaka, Yasuyuki Hashimoto	2018-01-30
9550264	Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer	Yuichi Kakizono, Yoshiaki Kurosawa	2017-01-24
9324558	Machining process for semiconductor wafer	Toshiyuki Tanaka, Yasuyuki Hashimoto	2016-04-26
9017145	Polishing solution distribution apparatus and polishing apparatus having the same	Yoshiaki Kurosawa, Yuichi Kakizono	2015-04-28
8759229	Method for manufacturing epitaxial wafer	Sakae Koyata, Kazushige Takaishi, Katsuhiko Murayama, Takeo Katoh	2014-06-24
8466071	Method for etching single wafer	Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh	2013-06-18
8092277	Method of grinding semiconductor wafers, grinding surface plate, and grinding device	Yasunori Yamada, Yuichi Kakizono	2012-01-10
8066896	Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer	Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh	2011-11-29
7955982	Method for smoothing wafer surface and apparatus used therefor	Takeo Katoh, Katsuhiko Murayama, Sakae Koyata, Kazushige Takaishi	2011-06-07
7906438	Single wafer etching method	Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh	2011-03-15
7717768	Wafer polishing apparatus and method for polishing wafers	Katsuhiko Murayama, Sakae Koyata, Kazushige Takaishi	2010-05-18
7648890	Process for producing silicon wafer	Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh	2010-01-19
7601644	Method for manufacturing silicon wafers	Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh	2009-10-13
7488400	Apparatus for etching wafer by single-wafer process	Sakae Koyata, Katsuhiko Murayama, Kazushige Takaishi, Takeo Katoh	2009-02-10
7288207	Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same	Sakae Koyata, Yuichi Kakizono, Katsuhiko Murayama	2007-10-30
6969302	Semiconductor wafer grinding method	—	2005-11-29
6753256	Method of manufacturing semiconductor wafer	Tooru Watanabe	2004-06-22
6465328	Semiconductor wafer manufacturing method	Kazunori Onizaki, Sumihisa Masuda	2002-10-15

Tomohiro Hashii — 20 Patents

Issued Patents All Time

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