Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6568384 | Semiconductor material cutting and processing method | — | 2003-05-27 |
| 6465328 | Semiconductor wafer manufacturing method | Tomohiro Hashii, Sumihisa Masuda | 2002-10-15 |
| 6283111 | Wire saw cutting method and apparatus therefor | Kenji Ogawa | 2001-09-04 |
| 6179909 | Work crystal orientation adjusting method and apparatus | Yoshiaki Banzawa | 2001-01-30 |