Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456168 | Method of lapping semiconductor wafer and semiconductor wafer | Daisuke Hashimoto, Tomohiro Hashii | 2022-09-27 |
| 8283252 | Method of manufacturing semiconductor wafer | Toru Taniguchi, Etsuro Morita, Seiji Harada, Isoroku Ono, Mitsuhiro Endo +1 more | 2012-10-09 |
| 7589023 | Method of manufacturing semiconductor wafer | Toru Taniguchi, Etsuro Morita, Seiji Harada, Isoroku Ono, Mitsuhiro Endo +1 more | 2009-09-15 |