Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9550264 | Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer | Tomohiro Hashii, Yoshiaki Kurosawa | 2017-01-24 |
| 9017145 | Polishing solution distribution apparatus and polishing apparatus having the same | Yoshiaki Kurosawa, Tomohiro Hashii | 2015-04-28 |
| 8092277 | Method of grinding semiconductor wafers, grinding surface plate, and grinding device | Tomohiro Hashii, Yasunori Yamada | 2012-01-10 |
| 7288207 | Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same | Sakae Koyata, Tomohiro Hashii, Katsuhiko Murayama | 2007-10-30 |