TK

Takeo Katoh

SU Sumco: 14 patents #18 of 464Top 4%
HC Hanyang Hak Won Co.: 1 patents #2 of 47Top 5%
Overall (All Time): #347,582 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10177008 Silicon wafer and method for manufacturing the same Takashi Nakayama, Kazumi Tanabe, Shigeru Umeno 2019-01-08
8877643 Method of polishing a silicon wafer Shuhei Matsuda, Tetsuro Iwashita, Ryuichi Tanimoto, Takeru Takushima 2014-11-04
8759229 Method for manufacturing epitaxial wafer Sakae Koyata, Kazushige Takaishi, Tomohiro Hashii, Katsuhiko Murayama 2014-06-24
8466071 Method for etching single wafer Sakae Koyata, Tomohiro Hashii, Katsuhiko Murayama, Kazushige Takaishi 2013-06-18
8379196 Method for judging whether semiconductor wafer is non-defective wafer by using laser scattering method Eiji Kamiyama, Takashi Nakayama 2013-02-19
8147295 Method of polishing silicon wafer Ryuichi Tanimoto, Shinichi Ogata, Takeru Takushima, Kazushige Takaishi 2012-04-03
8066896 Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer Sakae Koyata, Tomohiro Hashii, Katsuhiko Murayama, Kazushige Takaishi 2011-11-29
7955982 Method for smoothing wafer surface and apparatus used therefor Tomohiro Hashii, Katsuhiko Murayama, Sakae Koyata, Kazushige Takaishi 2011-06-07
7906438 Single wafer etching method Sakae Koyata, Tomohiro Hashii, Katsuhiko Murayama, Kazushige Takaishi 2011-03-15
7833908 Slurry composition for chemical-mechanical polishing capable of compensating nanotopography effect and method for planarizing surface of semiconductor device using the same Jea Gun Park, Won Mo Lee, Hyun Goo KANG, Sung Jun Kim, Un-gyu Paik 2010-11-16
7648890 Process for producing silicon wafer Sakae Koyata, Tomohiro Hashii, Katsuhiko Murayama, Kazushige Takaishi 2010-01-19
7601644 Method for manufacturing silicon wafers Sakae Koyata, Tomohiro Hashii, Katsuhiko Murayama, Kazushige Takaishi 2009-10-13
7491342 Bonded semiconductor substrate manufacturing method thereof Eiji Kamiyama, Jea Gun Park 2009-02-17
7488400 Apparatus for etching wafer by single-wafer process Sakae Koyata, Tomohiro Hashii, Katsuhiko Murayama, Kazushige Takaishi 2009-02-10