Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10177008 | Silicon wafer and method for manufacturing the same | Takashi Nakayama, Kazumi Tanabe, Shigeru Umeno | 2019-01-08 |
| 8877643 | Method of polishing a silicon wafer | Shuhei Matsuda, Tetsuro Iwashita, Ryuichi Tanimoto, Takeru Takushima | 2014-11-04 |
| 8759229 | Method for manufacturing epitaxial wafer | Sakae Koyata, Kazushige Takaishi, Tomohiro Hashii, Katsuhiko Murayama | 2014-06-24 |
| 8466071 | Method for etching single wafer | Sakae Koyata, Tomohiro Hashii, Katsuhiko Murayama, Kazushige Takaishi | 2013-06-18 |
| 8379196 | Method for judging whether semiconductor wafer is non-defective wafer by using laser scattering method | Eiji Kamiyama, Takashi Nakayama | 2013-02-19 |
| 8147295 | Method of polishing silicon wafer | Ryuichi Tanimoto, Shinichi Ogata, Takeru Takushima, Kazushige Takaishi | 2012-04-03 |
| 8066896 | Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer | Sakae Koyata, Tomohiro Hashii, Katsuhiko Murayama, Kazushige Takaishi | 2011-11-29 |
| 7955982 | Method for smoothing wafer surface and apparatus used therefor | Tomohiro Hashii, Katsuhiko Murayama, Sakae Koyata, Kazushige Takaishi | 2011-06-07 |
| 7906438 | Single wafer etching method | Sakae Koyata, Tomohiro Hashii, Katsuhiko Murayama, Kazushige Takaishi | 2011-03-15 |
| 7833908 | Slurry composition for chemical-mechanical polishing capable of compensating nanotopography effect and method for planarizing surface of semiconductor device using the same | Jea Gun Park, Won Mo Lee, Hyun Goo KANG, Sung Jun Kim, Un-gyu Paik | 2010-11-16 |
| 7648890 | Process for producing silicon wafer | Sakae Koyata, Tomohiro Hashii, Katsuhiko Murayama, Kazushige Takaishi | 2010-01-19 |
| 7601644 | Method for manufacturing silicon wafers | Sakae Koyata, Tomohiro Hashii, Katsuhiko Murayama, Kazushige Takaishi | 2009-10-13 |
| 7491342 | Bonded semiconductor substrate manufacturing method thereof | Eiji Kamiyama, Jea Gun Park | 2009-02-17 |
| 7488400 | Apparatus for etching wafer by single-wafer process | Sakae Koyata, Tomohiro Hashii, Katsuhiko Murayama, Kazushige Takaishi | 2009-02-10 |