Issued Patents All Time
Showing 176–192 of 192 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7955942 | Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame | Yaojian Lin | 2011-06-07 |
| 7952176 | Integrated circuit packaging system and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2011-05-31 |
| 7927917 | Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof | Byung Tai Do, Jong-Woo Ha | 2011-04-19 |
| 7911070 | Integrated circuit packaging system having planar interconnect | Byung Tai Do, Heap Hoe Kuan | 2011-03-22 |
| 7880275 | Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device | Byung Tai Do, Rui Huang | 2011-02-01 |
| 7859085 | Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias | Byung Tai Do, Yaojian Lin | 2010-12-28 |
| 7847382 | Integrated circuit packaging system with package stacking and method of manufacture thereof | Byung Tai Do | 2010-12-07 |
| 7799602 | Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure | Rui Huang, Yaojian Lin | 2010-09-21 |
| 7776655 | Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices | Byung Tai Do, Linda Pei Ee Chua | 2010-08-17 |
| 7772046 | Semiconductor device having electrical devices mounted to IPD structure and method for shielding electromagnetic interference | Byung Tai Do, Yaojian Lin, Rui Huang | 2010-08-10 |
| 7750455 | Triple tier package on package system | Byung Tai Do | 2010-07-06 |
| 7741156 | Semiconductor device and method of forming through vias with reflowed conductive material | Linda Pei Ee Chua, Byung Tai Do | 2010-06-22 |
| 7704796 | Semiconductor device and method of forming recessed conductive vias in saw streets | Byung Tai Do, Heap Hoe Kuan | 2010-04-27 |
| 7666711 | Semiconductor device and method of forming double-sided through vias in saw streets | Byung Tai Do | 2010-02-23 |
| 7659145 | Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device | Byung Tai Do, Heap Hoe Kuan, Linda Pei Ee Chua | 2010-02-09 |
| 7648911 | Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias | Byung Tai Do, Yaojian Lin | 2010-01-19 |
| 7618846 | Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device | Byung Tai Do, Rui Huang | 2009-11-17 |