Issued Patents All Time
Showing 51–71 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515029 | Radio frequency module including segmented conductive top layer | Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Guohao Zhang, Dinhphuoc Vu Hoang | 2016-12-06 |
| 9419667 | Apparatus and methods related to conformal coating implemented with surface mount devices | Howard E. Chen, Robert Francis Darveaux, Hoang Mong Nguyen, Matthew Sean Read, Lori Ann DeOrio | 2016-08-16 |
| 9295157 | Racetrack design in radio frequency shielding applications | Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Guohao Zhang, Dinhphuoc Vu Hoang | 2016-03-22 |
| 9252107 | Semiconductor package having a metal paint layer | Matthew Sean Read, Hoang Mong Nguyen, Howard E. Chen, Dinhphuoc Vu Hoang | 2016-02-02 |
| 9214387 | Systems and methods for providing intramodule radio frequency isolation | Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Guohao Zhang, Dinhphuoc Vu Hoang | 2015-12-15 |
| 9202748 | Segmented conductive ground plane for radio frequency isolation | Hoang Mong Nguyen | 2015-12-01 |
| 9203529 | Via placement in radio frequency shielding applications | Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Guohao Zhang, Dinhphuoc Vu Hoang | 2015-12-01 |
| 9202747 | Segmented conductive top layer for radio frequency isolation | Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Guohao Zhang, Dinhphuoc Vu Hoang | 2015-12-01 |
| 9071335 | Radio-frequency modules having tuned shielding-wirebonds | Anil Agarwal, Dinhphuoc Vu Hoang, Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen +1 more | 2015-06-30 |
| 9054115 | Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding | Dinhphuoc Vu Hoang, Thomas E. Noll, Anil Agarwal, Robert W. Warren, Matthew Sean Read | 2015-06-09 |
| 9041168 | Overmolded semiconductor package with wirebonds for electromagnetic shielding | Dinhphuoc Vu Hoang, Thomas E. Noll, Anil Agarwal, Robert W. Warren, Matthew Sean Read | 2015-05-26 |
| 9041472 | Power amplifier modules including related systems, devices, and methods | Howard E. Chen, Yifan Guo, Dinhphuoc Vu Hoang, Mehran Janani, Tin Myint Ko +15 more | 2015-05-26 |
| 8948712 | Via density and placement in radio frequency shielding applications | Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Guohao Zhang, Dinhphuoc Vu Hoang | 2015-02-03 |
| 8399972 | Overmolded semiconductor package with a wirebond cage for EMI shielding | Dinhphuoc Vu Hoang, Thomas E. Noll, Anil Agarwal, Robert W. Warren, Matthew Sean Read | 2013-03-19 |
| 8071431 | Overmolded semiconductor package with a wirebond cage for EMI shielding | Dinphuoc V. Hoang, Thomas E. Noll, Anil Agarwal, Robert W. Warren, Matthew Sean Read | 2011-12-06 |
| 7696064 | Methods for forming a through via | Qing-Cao Gan | 2010-04-13 |
| 7629201 | Method for fabricating a wafer level package with device wafer and passive component integration | Qing-Cao Gan, Robert W. Warren, Steve Xin Liang | 2009-12-08 |
| 7576426 | Wafer level package including a device wafer integrated with a passive component | Qing-Cao Gan, Robert W. Warren, Steve Xin Liang | 2009-08-18 |
| 6596212 | Method and apparatus for increasing thickness of molded body on semiconductor package | Jonathon G. Greenwood | 2003-07-22 |
| 6534338 | Method for molding semiconductor package having a ceramic substrate | Ronald James Schoonejongen, Frank J. Juskey | 2003-03-18 |
| 6340846 | Making semiconductor packages with stacked dies and reinforced wire bonds | Frank J. Juskey, Stephen G. Shermer, Vincent DiCaprio, Thomas P. Glenn | 2002-01-22 |