Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9640413 | Etching-before-packaging horizontal chip 3D system-level metal circuit board structure and technique thereof | Chih-Chung Liang, Yu-Bin Lin, Yaqin Wang, Youhai Zhang | 2017-05-02 |
| 9153551 | Integrated circuit package including in-situ formed cavity | — | 2015-10-06 |
| 8900931 | In-situ cavity integrated circuit package | — | 2014-12-02 |
| 7642135 | Thermal mechanical flip chip die bonding | — | 2010-01-05 |
| 7629201 | Method for fabricating a wafer level package with device wafer and passive component integration | Qing-Cao Gan, Robert W. Warren, Anthony James LoBianco | 2009-12-08 |
| 7576426 | Wafer level package including a device wafer integrated with a passive component | Qing-Cao Gan, Robert W. Warren, Anthony James LoBianco | 2009-08-18 |