Issued Patents All Time
Showing 51–75 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9800222 | Frequency compensated oscillator design for process tolerances | Markus Lutz | 2017-10-24 |
| 9771257 | Electromechanical system having a controlled atmosphere, and method of fabricating same | Markus Lutz, Silvia Kronmueller | 2017-09-26 |
| 9774313 | Laterally-doped MEMS resonator | Charles I. Grosjean, Ginel C. Hill, Paul M. Hagelin, Renata Melamud Berger, Markus Lutz | 2017-09-26 |
| 9758371 | Encapsulated microelectromechanical structure | Markus Lutz, Pavan Gupta | 2017-09-12 |
| 9695036 | Temperature insensitive resonant elements and oscillators and methods of designing and manufacturing same | Renata Melamud Berger, Ginel C. Hill, Paul M. Hagelin, Charles I. Grosjean, Joseph C. Doll +1 more | 2017-07-04 |
| 9677948 | MEMS device with micromachined thermistor | Carl Arft, Paul M. Hagelin | 2017-06-13 |
| 9667223 | Resonator electrode shields | David Raymond Pedersen, Thor Juneau | 2017-05-30 |
| 9440845 | Encapsulated microelectromechanical structure | Markus Lutz, Pavan Gupta | 2016-09-13 |
| 9434608 | Wafer encapsulated microelectromechanical structure | Markus Lutz, Pavan Gupta | 2016-09-06 |
| 9371221 | Low-profile stacked-die MEMS resonator system | Pavan Gupta, Markus Lutz | 2016-06-21 |
| 9252740 | Resonator electrode shields | David Raymond Pedersen, Thor Juneau | 2016-02-02 |
| 9022644 | Micromachined thermistor and temperature measurement circuitry, and method of manufacturing and operating same | Carl Arft, Paul M. Hagelin | 2015-05-05 |
| 8980668 | Integrated getter area for wafer level encapsulated microelectromechanical systems | Markus Lutz | 2015-03-17 |
| 8941247 | Stacked die package for MEMS resonator system | Pavan Gupta, Markus Lutz | 2015-01-27 |
| 8916407 | MEMS device and method of manufacturing same | Charles I. Grosjean, Ginel C. Hill, Paul M. Hagelin, Renata Melamud Berger, Markus Lutz | 2014-12-23 |
| 8871551 | Wafer encapsulated microelectromechanical structure and method of manufacturing same | Markus Lutz, Pavan Gupta | 2014-10-28 |
| 8749315 | Resonator electrode shields | David Raymond Pedersen, Thor Juneau | 2014-06-10 |
| 8669664 | Stacked die package for MEMS resonator system | Pavan Gupta, Markus Lutz | 2014-03-11 |
| 8623686 | Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same | Markus Lutz, Silvia Kronmueller | 2014-01-07 |
| 8421167 | Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same | Markus Lutz, Silvia Kronmueller | 2013-04-16 |
| 8372676 | Integrated getter area for wafer level encapsulated microelectromechanical systems | Markus Lutz | 2013-02-12 |
| 8343790 | Methods for trapping charge in a microelectromechanical system and microelectromechanical system employing same | Markus Lutz, Brian Stark | 2013-01-01 |
| 8324986 | MEMS resonator array structure and method of operating and using same | Markus Lutz, Zhiyu Pan | 2012-12-04 |
| 8324729 | Stacked die package for MEMS resonator system | Pavan Gupta, Markus Lutz | 2012-12-04 |
| 8287956 | Crack and residue free conformal deposited silicon oxide with predictable and uniform etching characteristics | Markus Lutz, Silvia Kronmueller | 2012-10-16 |