HU

Hiroyuki Urano

SC Shin-Etsu Chemical Co.: 24 patents #185 of 2,176Top 9%
JT Jtekt: 2 patents #749 of 1,969Top 40%
IBM: 2 patents #32,839 of 70,183Top 50%
KC Koyo Seiko Co.: 1 patents #363 of 749Top 50%
📍 Joetsu, JP: #43 of 239 inventorsTop 20%
Overall (All Time): #140,636 of 4,157,543Top 4%
27
Patents All Time

Issued Patents All Time

Showing 1–25 of 27 patents

Patent #TitleCo-InventorsDate
12195568 Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component Masashi Iio, Osamu Watanabe, Katsuya Takemura 2025-01-14
12197127 Negative photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component Masashi Iio, Osamu Watanabe, Katsuya Takemura 2025-01-14
12085856 Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component Masashi Iio, Osamu Watanabe, Katsuya Takemura 2024-09-10
11892773 Photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component Masashi Iio, Katsuya Takemura 2024-02-06
11768434 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts Katsuya Takemura, Masashi Iio, Kazuya Honda 2023-09-26
11572442 Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component Dmitry Zubarev, Katsuya Takemura, Masashi Iio, Kazuya Honda, Yoshio Kawai 2023-02-07
11333975 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component Dmitry Zubarev, Katsuya Takemura, Masashi Iio, Kazuya Honda, Yoshio Kawai 2022-05-17
11150556 Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts Katsuya Takemura, Masashi Iio 2021-10-19
10919918 Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts Hiroki Takano, Masashi Iio, Katsuya Takemura, Kazuya Honda 2021-02-16
10816900 Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film Katsuya Takemura, Masashi Iio, Koji Hasegawa, Kenji Funatsu 2020-10-27
10457779 Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film Katsuya Takemura, Masashi Iio, Masayoshi Sagehashi, Koji Hasegawa 2019-10-29
10216085 Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured film Katsuya Takemura, Masashi Iio, Masayoshi Sagehashi, Koji Hasegawa 2019-02-26
10203601 Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film Katsuya Takemura, Masashi Iio, Koji Hasegawa, Kenji Funatsu 2019-02-12
10197914 Positive photosensitive resin composition, photo-curable dry film and method for producing the same, patterning process, and laminate Katsuya Takemura, Masashi Iio, Takashi Miyazaki 2019-02-05
10114287 Silicone skeleton-containing polymer compound and method for producing same, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, and substrate Masashi Iio, Katsuya Takemura, Koji Hasegawa, Masahiro Fukushima, Takayuki Fujiwara 2018-10-30
10087288 Silicone skeleton-containing polymer compound, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, substrate, and semiconductor apparatus Masashi Iio, Katsuya Takemura, Takashi Miyazaki 2018-10-02
9557645 Positive photosensitive resin composition, photo-curable dry film and method for producing same, layered product, patterning process, and substrate Katsuya Takemura, Masashi Iio, Takashi Miyazaki 2017-01-31
9400428 Polymer compound, chemically amplified negative resist composition, photo-curable dry film and production method thereof, layered product, patterning process, and substrate Masashi Iio, Katsuya Takemura, Takashi Miyazaki 2016-07-26
9377689 Silicone structure-bearing polymer, negative resist composition, photo-curable dry film, patterning process, and electric/electronic part-protecting film Katsuya Takemura, Masashi Iio, Takayuki Fujiwara, Koji Hasegawa 2016-06-28
9366961 Silicone structure-bearing polymer, resin composition, and photo-curable dry film Katsuya Takemura, Takashi Miyazaki 2016-06-14
9310681 Negative resist composition and patterning process using same Jun Hatakeyama, Masashi Iio 2016-04-12
9091919 Silicone structure-bearing polymer, resin composition, and photo-curable dry film Katsuya Takemura, Takashi Miyazaki 2015-07-28
8865391 Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film Katsuya Takemura, Takashi Miyazaki 2014-10-21
8835697 Biphenyl derivative, resist bottom layer material, bottom layer forming method, and patterning process Daisuke KORI, Takeshi Kinsho, Katsuya Takemura, Tsutomu Ogihara, Takeru Watanabe 2014-09-16
8439570 Rolling bearing assembly and method of forming a lubrication device therefor 2013-05-14