Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12378386 | Resin composition and application thereof | Naidong SHE, Qianfa Liu, Zengbiao Huang, Songgang Chai, Yanhua Zhang | 2025-08-05 |
| 12234318 | Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition | Yong Chen, Guofang TANG | 2025-02-25 |
| 12122904 | Thermosetting resin composition and prepreg, laminate and printed circuit board using same | Huayong FAN, Zengbiao Huang | 2024-10-22 |
| 11930595 | Circuit material and circuit board containing the same | Weifeng YIN, Cui HUO, RUI-WU LIU, Shanyin YAN | 2024-03-12 |
| 11732123 | Thermosetting resin composition, and prepreg, laminate and printed circuit board using same | Zengbiao Huang, Huayong FAN, Jianlong Huang, Naidong SHE | 2023-08-22 |
| 11584851 | Resin composition, and prepreg and circuit material using the same | Jianying Shi, Weifeng YIN, Shanyin YAN | 2023-02-21 |
| 11191158 | Circuit board and process for preparing the same | Shanyin YAN, Zhongqiang Yang, Yongming Zhu | 2021-11-30 |
| 10645806 | Polyphenyl ether resin composition and use thereof in high-frequency circuit substrate | Guangbing Chen, Xianping Zeng, Chiji Guan | 2020-05-05 |
| 10513605 | Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same | Hui Li, Kehong Fang | 2019-12-24 |
| 10513608 | Process for preparing resin composition comprising benzoxazine, prepreg and laminate prepared therefrom | Long Xi, Jiang Li | 2019-12-24 |
| 10494502 | Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the same | Jiang You, Tianhui HUANG, Zhongqiang Yang | 2019-12-03 |
| 10400173 | Siloxane-modified cyclotriphosphazene halogen-free flame retardant, preparation process and use thereof | Yongzhen Wang, Yueshan He, Zhongqiang Yang | 2019-09-03 |
| 10400099 | Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same | Hui Li, Kehong Fang | 2019-09-03 |
| 10240074 | Degradable and recyclable epoxy conductive adhesive as well as preparing, degrading and recycling methods therefor | Zengbiao Huang, Huayang Deng | 2019-03-26 |
| 10208156 | Epoxy resin composition, prepreg and laminate using same | Xianping Zeng, Liexiang He | 2019-02-19 |