Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308252 | Interposer, manufacturing method therefor, and circuit board assembly | Man-Zhi Peng, Si-Si Xiong, Lin Gao | 2025-05-20 |
| 12104979 | Whole vehicle in-loop test system of intelligent automobile | Zhuoping Yu, Xichan Zhu, Lu Xiong, Gang Xu, Yi Zhou +1 more | 2024-10-01 |
| 11930595 | Circuit material and circuit board containing the same | Weifeng YIN, Cui HUO, Yongjing XU, Shanyin YAN | 2024-03-12 |
| 11917278 | Camera module of reduced size and method for manufacturing the same | Man-Zhi Peng, Jia-He Li | 2024-02-27 |
| 11665820 | Adapter board and method for making adapter board | Man-Zhi Peng, MING-JAAN HO | 2023-05-30 |
| 11638481 | Smart cabinet | Zhihong Peng | 2023-05-02 |
| 11510319 | Connecting structure | MING-JAAN HO, Man-Zhi Peng | 2022-11-22 |
| 11483938 | Method for connecting stacked circuit boards | MING-JAAN HO, Man-Zhi Peng | 2022-10-25 |
| 11310922 | Board-to-board connecting structure and method for manufacturing the same | Man-Zhi Peng | 2022-04-19 |
| 11252818 | Printed circuit board and method for manufacturing the same | MING-JAAN HO, Lei Zhou, Man-Zhi Peng | 2022-02-15 |
| 11051404 | Method for connecting stacked circuits boards | MING-JAAN HO, Man-Zhi Peng | 2021-06-29 |
| 10910300 | Method for manufacturing interposer | Man-Zhi Peng, MING-JAAN HO | 2021-02-02 |
| 10849229 | Printed circuit board and method for manufacturing the same | MING-JAAN HO, Lei Zhou, Man-Zhi Peng | 2020-11-24 |
| 10405431 | Flexible printed circuit board | Lei Zhou, Qiong Zhou | 2019-09-03 |
| 10111336 | Method of making a flexible printed circuit board | Lei Zhou, Qiong Zhou | 2018-10-23 |
| 9066417 | Method for manufacturing printed circuit board | Yu-Hsien Lee, Wen-Hsin Yu | 2015-06-23 |
| 9066431 | Method for manufacturing printed circuit board with patterned electrically conductive layer therein visible | MING-JAAN HO, XIAN-QIN HU | 2015-06-23 |
| 8453324 | Method of manufacturing FPCB substrate | Yung-Wei Lai, Shing-Tza Liou | 2013-06-04 |