Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8453324 | Method of manufacturing FPCB substrate | RUI-WU LIU, Yung-Wei Lai | 2013-06-04 |
| 8205330 | Method for manufacturing a printed circuit board | Qi Zhang, Yung-Wei Lai | 2012-06-26 |
| 8164000 | Flexible printed circuit boards including carbon nanotube bundles | Tso-Hung Yeh, Hung-Yi Chang | 2012-04-24 |
| 8071887 | Printed circuit board and method for manufacturing same | Yao-Wen Bai, Cheng-Hsien Lin | 2011-12-06 |
| 8052881 | Method of manufacturing multilayer printed circuit board having buried holes | Yun Zhu, Yung-Wei Lai | 2011-11-08 |
| 7998332 | Electroplating method | Yao-Wen Bai, Rui Zhang, QIU-YUE ZHANG | 2011-08-16 |
| 7985482 | Stiffener sheet and flexible printed circuit board using the same | Yung-Wei Lai, Cheng-Wei Kuo | 2011-07-26 |
| 7728232 | Printed circuit board assembly having adhesive layer | Feng Huang | 2010-06-01 |
| 7511962 | Flexible printed circuit board | Ning Hou | 2009-03-31 |