Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8453324 | Method of manufacturing FPCB substrate | RUI-WU LIU, Shing-Tza Liou | 2013-06-04 |
| 8205330 | Method for manufacturing a printed circuit board | Qi Zhang, Shing-Tza Liou | 2012-06-26 |
| 8052881 | Method of manufacturing multilayer printed circuit board having buried holes | Yun Zhu, Shing-Tza Liou | 2011-11-08 |
| 7985482 | Stiffener sheet and flexible printed circuit board using the same | Cheng-Wei Kuo, Shing-Tza Liou | 2011-07-26 |
| 7098097 | Mass-production packaging means and mass-production packaging method | Yih Chang, Mau-Kuo Wei, Jih-Yi Wang, Chou-Ho Shyu | 2006-08-29 |
| 6758713 | Package method and apparatus for organic electro-luminescent display | Mao-Kuo Wei | 2004-07-06 |