Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11930595 | Circuit material and circuit board containing the same | Weifeng YIN, Cui HUO, RUI-WU LIU, Yongjing XU | 2024-03-12 |
| 11744013 | Composite, high-frequency circuit substrate prepared therefrom and process for preparing the same | Minshe Su, Duye Li, Qianfa Liu, Zhongqiang Yang | 2023-08-29 |
| 11584851 | Resin composition, and prepreg and circuit material using the same | Jianying Shi, Weifeng YIN, Yongjing XU | 2023-02-21 |
| 11261305 | Thermosetting resin composition, prepreg, laminate, and printed circuit board | Guangbin Chen, Qianfa Liu, Xianping Zeng, Cuiming Du | 2022-03-01 |
| 11191158 | Circuit board and process for preparing the same | Yongjing XU, Zhongqiang Yang, Yongming Zhu | 2021-11-30 |
| 11053352 | Vinyl thermosetting resin composition, prepreg, laminate, and printed circuit board | Guangbin Chen, Qianfa Liu, Xianping Zeng, Cuiming Du | 2021-07-06 |