Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11744013 | Composite, high-frequency circuit substrate prepared therefrom and process for preparing the same | Duye Li, Shanyin YAN, Qianfa Liu, Zhongqiang Yang | 2023-08-29 |
| 11377551 | Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board | Zhongqiang Yang | 2022-07-05 |
| 11319397 | Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board | Zhongqiang Yang | 2022-05-03 |
| 10194528 | Composite material, high-frequency circuit baseboard made therefrom and production method thereof | — | 2019-01-29 |
| 9744745 | Circuit substrate and manufacturing method thereof | Qianfa Liu | 2017-08-29 |
| 9193858 | Thermoset resin composition and its use | Yong Chen, Guofang TANG, Zhongqiang Yang | 2015-11-24 |