Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12234318 | Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition | Yong Chen, Yongjing XU | 2025-02-25 |
| 10414136 | Halogen-free and phosphorus-free silicone resin composition, prepreg, laminate board, copper-clad plate using the same, and printed circuit board | Xiaosheng SU, Suwen Ye | 2019-09-17 |
| 10336905 | Organic silicon resin composition, white prepreg and white laminate using same | Suwen Ye, Peng Sun | 2019-07-02 |
| 10308808 | Organic silicone resin composition and pre-preg, laminate, copper-clad laminate, and aluminum substrate that use the composition | Suwen Ye | 2019-06-04 |
| 10030143 | Ceramized silicone resin composition and pre-preg and laminate that use the composition | Suwen Ye | 2018-07-24 |
| 9193858 | Thermoset resin composition and its use | Minshe Su, Yong Chen, Zhongqiang Yang | 2015-11-24 |