Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12104054 | Resin composition, prepreg containing same, laminate, and printed circuit board | Liexiang He, Yongnian Qi, Xianping Zeng, Hualin Pan | 2024-10-01 |
| 11744013 | Composite, high-frequency circuit substrate prepared therefrom and process for preparing the same | Minshe Su, Duye Li, Shanyin YAN, Qianfa Liu | 2023-08-29 |
| 11377551 | Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board | Minshe Su | 2022-07-05 |
| 11319397 | Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board | Minshe Su | 2022-05-03 |
| 11191158 | Circuit board and process for preparing the same | Shanyin YAN, Yongjing XU, Yongming Zhu | 2021-11-30 |
| 10494502 | Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the same | Jiang You, Tianhui HUANG, Yongjing XU | 2019-12-03 |
| 10400058 | Degradable resin composition, and prepreg, laminate and copper clad laminate using same, and degrading method thereof | Huayang Deng, Zengbiao Huang, Qianfa Liu, Peng Wang | 2019-09-03 |
| 10400173 | Siloxane-modified cyclotriphosphazene halogen-free flame retardant, preparation process and use thereof | Yongzhen Wang, Yueshan He, Yongjing XU | 2019-09-03 |
| 9752028 | Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the same | Jiang You, Tianhui HUANG | 2017-09-05 |
| 9611377 | Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same | Jiang You, Tianhui HUANG | 2017-04-04 |
| 9475970 | Epoxy resin composition and copper clad laminate manufactured by using same | Cuiming Du, Songgang Chai | 2016-10-25 |
| 9193858 | Thermoset resin composition and its use | Minshe Su, Yong Chen, Guofang TANG | 2015-11-24 |