Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12378386 | Resin composition and application thereof | Naidong SHE, Qianfa Liu, Zengbiao Huang, Yongjing XU, Yanhua Zhang | 2025-08-05 |
| 11945924 | Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, laminate, copper clad laminate and printed circuit board containing the same | Qianfa Liu, Liangpeng HAO, Wei Liang | 2024-04-02 |
| 10208188 | Thermosetting resin composition and uses thereof | Cuiming Du, Liangpeng HAO | 2019-02-19 |
| 10053547 | Thermosetting resin composition and uses thereof | Cuiming Du | 2018-08-21 |
| 9475970 | Epoxy resin composition and copper clad laminate manufactured by using same | Cuiming Du, Zhongqiang Yang | 2016-10-25 |