Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11945924 | Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, laminate, copper clad laminate and printed circuit board containing the same | Songgang Chai, Qianfa Liu, Wei Liang | 2024-04-02 |
| 10208188 | Thermosetting resin composition and uses thereof | Cuiming Du, Songgang Chai | 2019-02-19 |