Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12378386 | Resin composition and application thereof | Naidong SHE, Qianfa Liu, Yongjing XU, Songgang Chai, Yanhua Zhang | 2025-08-05 |
| 12122904 | Thermosetting resin composition and prepreg, laminate and printed circuit board using same | Huayong FAN, Yongjing XU | 2024-10-22 |
| 11732123 | Thermosetting resin composition, and prepreg, laminate and printed circuit board using same | Huayong FAN, Yongjing XU, Jianlong Huang, Naidong SHE | 2023-08-22 |
| 11661378 | Boron nitride agglomerate, thermosetting resin composition containing same, and use thereof | — | 2023-05-30 |
| 11649351 | Resin composition for a metal substrate, and resin varnish and metal base copper-clad laminate comprising the same | Naidong SHE | 2023-05-16 |
| 10400058 | Degradable resin composition, and prepreg, laminate and copper clad laminate using same, and degrading method thereof | Huayang Deng, Qianfa Liu, Zhongqiang Yang, Peng Wang | 2019-09-03 |
| 10240074 | Degradable and recyclable epoxy conductive adhesive as well as preparing, degrading and recycling methods therefor | Huayang Deng, Yongjing XU | 2019-03-26 |