Issued Patents All Time
Showing 1–25 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12369275 | Heat equalization plate | FU-YUN SHEN, HSIAO-TING HSU | 2025-07-22 |
| 12320718 | Pressure sensing circuit board and method for manufacturing the same | FU-YUN SHEN, HSIAO-TING HSU | 2025-06-03 |
| 12156348 | Embedded circuit board and manufacturing method thereof | Cheng-Yi Yang, Hao Zhong, Biao Li, Ning Hou | 2024-11-26 |
| 12063752 | Methods of manufacturing circuit board and circuit board assembly | Wen-Zhu Wei, FU-YUN SHEN, Hong Guo | 2024-08-13 |
| 12048084 | Covering film, and circuit board and manufacturing method | HSIAO-TING HSU, Katsumi Fujiwara, FU-YUN SHEN, Fu-Wei Zhong | 2024-07-23 |
| 11991838 | Embedded circuit board and manufacturing method thereof | Cheng-Yi Yang, Hao Zhong, Biao Li, Ning Hou | 2024-05-21 |
| 11979977 | Circuit board with heat dissipation structure and method for manufacturing same | HSIAO-TING HSU, Tao Liao, XIAN-QIN HU, FU-YUN SHEN | 2024-05-07 |
| 11950357 | Circuit board for transmitting high-frequency signal and method for manufacturing the same | FU-YUN SHEN, Hong Guo, HSIAO-TING HSU | 2024-04-02 |
| 11902644 | Camera module and method for manufacturing the same | Jun Dai, Mei Yang | 2024-02-13 |
| 11778752 | Circuit board with embedded electronic component and method for manufacturing the same | HSIAO-TING HSU, FU-YUN SHEN | 2023-10-03 |
| 11765818 | Method for manufacturing transmission circuit board | FU-YUN SHEN, Wen-Zhu Wei | 2023-09-19 |
| 11672100 | Heat equalization plate and method for manufacturing the same | FU-YUN SHEN, HSIAO-TING HSU | 2023-06-06 |
| 11665820 | Adapter board and method for making adapter board | Man-Zhi Peng, RUI-WU LIU | 2023-05-30 |
| 11665833 | Circuit board and manufacturing method thereof | XIAN-QIN HU, FU-YUN SHEN, HSIAO-TING HSU, Yong-Chao Wei | 2023-05-30 |
| 11510319 | Connecting structure | RUI-WU LIU, Man-Zhi Peng | 2022-11-22 |
| 11483938 | Method for connecting stacked circuit boards | RUI-WU LIU, Man-Zhi Peng | 2022-10-25 |
| 11457532 | Method of manufacturing circuit board | FU-YUN SHEN, HSIAO-TING HSU, Lin Gao | 2022-09-27 |
| 11380603 | Method for making a heat dissipation structure | FU-YUN SHEN, Cong Lei, HSIAO-TING HSU | 2022-07-05 |
| 11297748 | Electromagnetic shielding film | FU-YUN SHEN, HSIAO-TING HSU | 2022-04-05 |
| 11296444 | Edge-to-edge board connection structure | Man-Zhi Peng | 2022-04-05 |
| 11261328 | Circuit board using low dielectric resin composition | SZU-HSIANG SU, SHOU-JUI HSIANG, Mao-Feng Hsu | 2022-03-01 |
| 11259405 | Transmission circuit board and method for manufacturing the same | FU-YUN SHEN, Wen-Zhu Wei | 2022-02-22 |
| 11252818 | Printed circuit board and method for manufacturing the same | RUI-WU LIU, Lei Zhou, Man-Zhi Peng | 2022-02-15 |
| 11212922 | Circuit board and manufacturing method thereof | XIAN-QIN HU, FU-YUN SHEN, HSIAO-TING HSU, Yong-Chao Wei | 2021-12-28 |
| 11134564 | Transparent PCB and method for manufacturing the same | HSIAO-TING HSU, FU-YUN SHEN, LI-KUN LIU | 2021-09-28 |