MH

MING-JAAN HO

AL Avary Holding (Shenzhen) Co., Limited.: 50 patents #1 of 109Top 1%
QC Qing Ding Precision Electronics (Huaian) Co.: 24 patents #1 of 64Top 2%
ZC Zhen Ding Technology Co.: 10 patents #3 of 98Top 4%
FC Fukui Precision Component (Shenzhen) Co.: 9 patents #1 of 56Top 2%
GC Garuda Technology Co.: 8 patents #1 of 48Top 3%
📍 New Taipei, TW: #111 of 10,472 inventorsTop 2%
Overall (All Time): #34,445 of 4,157,543Top 1%
64
Patents All Time

Issued Patents All Time

Showing 51–64 of 64 patents

Patent #TitleCo-InventorsDate
10012454 Heat dissipation device and method for manufacturing same XIAN-QIN HU, FU-YUN SHEN 2018-07-03
9992858 Printed circuit board XIAN-QIN HU, Yi-Qiang Zhuang, Fu-Wei Zhong 2018-06-05
9820388 Printed circuit board and method for manufacturing same XIAN-QIN HU, Zhi Wang 2017-11-14
9807868 Method for making conductive polymer, and composite film and circuit board having the conductive polymer HSIAO-TING HSU 2017-10-31
9706640 Method for manufacturing printed circuit board XIAN-QIN HU, Yi-Qiang Zhuang, Fu-Wei Zhong 2017-07-11
9693448 Flexible circuit board and method for making the same XIAN-QIN HU 2017-06-27
9622340 Flexible circuit board and method for manufacturing same XIAN-QIN HU, Yan-Lu Li, Wen-Hsin Yu 2017-04-11
9615445 Flexible circuit board and method for manufacturing same XIAN-QIN HU, FU-YUN SHEN, Yi-Qiang Zhuang 2017-04-04
9485859 Flexible circuit board and method for manufacturing same XIAN-QIN HU, FU-YUN SHEN, Jian Luo, Yi-Qiang Zhuang 2016-11-01
9357631 Flexible printed circuit board and method for making same XIAN-QIN HU, Shao-Hua Wang, FU-YUN SHEN 2016-05-31
9288914 Method of manufacturing a printed circuit board with circuit visible XIAN-QIN HU 2016-03-15
9277640 Flexible printed circuit board and method for manufacturing same XIAN-QIN HU, FU-YUN SHEN, Yi-Qiang Zhuang 2016-03-01
9066431 Method for manufacturing printed circuit board with patterned electrically conductive layer therein visible RUI-WU LIU, XIAN-QIN HU 2015-06-23
8647518 Resin coated copper foil, method for manufacturing same and multi-layer circuit board 2014-02-11