Issued Patents All Time
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11051404 | Method for connecting stacked circuits boards | RUI-WU LIU, Man-Zhi Peng | 2021-06-29 |
| 10923411 | Method for manufacturing an ultrathin heat dissipation structure | Ning Hou, Cong Lei, Biao Li | 2021-02-16 |
| 10910300 | Method for manufacturing interposer | Man-Zhi Peng, RUI-WU LIU | 2021-02-02 |
| 10894882 | Low dielectric resin composition, film and circuit board using the same | SZU-HSIANG SU, SHOU-JUI HSIANG, Mao-Feng Hsu | 2021-01-19 |
| 10874016 | Method of manufacturing physical structure for high frequency signal transmission | HSIAO-TING HSU | 2020-12-22 |
| 10863620 | Bendable circuit board and method for manufacturing the same | Hao Zhong, Biao Li, Man-Zhi Peng | 2020-12-08 |
| 10849229 | Printed circuit board and method for manufacturing the same | RUI-WU LIU, Lei Zhou, Man-Zhi Peng | 2020-11-24 |
| 10822522 | Modified polyimide compound, resin composition and polyimide film | Mao-Feng Hsu, SHOU-JUI HSIANG, NAN-KUN HUANG, YU-WEN KAO, CHIA-YIN TENG +1 more | 2020-11-03 |
| 10791625 | Method for manufacturing flexible printed circuit board | XIAN-QIN HU | 2020-09-29 |
| 10745595 | Resin composition, adhesive layer, and circuit board utilizing same | FU-YUN SHEN, Cong Lei, HSIAO-TING HSU | 2020-08-18 |
| 10658265 | Heat dissipation structure, method for making the same, and electronic device having the same | FU-YUN SHEN, Cong Lei, HSIAO-TING HSU | 2020-05-19 |
| 10660218 | Method of manufacturing multilayer circuit board | XIAN-QIN HU, LI-KUN LIU, Yan-Lu Li | 2020-05-19 |
| 10660210 | Flexible circuit board | FU-YUN SHEN, HSIAO-TING HSU | 2020-05-19 |
| 10653015 | Multilayer circuit board and method of manufacturing the same | XIAN-QIN HU, LI-KUN LIU, Yan-Lu Li | 2020-05-12 |
| 10575406 | Method of making flexible circuit board | FU-YUN SHEN, HSIAO-TING HSU | 2020-02-25 |
| 10533811 | Heat dissipation device | XIAN-QIN HU, FU-YUN SHEN | 2020-01-14 |
| 10448540 | Ultrathin heat dissipation structure | Ning Hou, Cong Lei, Biao Li | 2019-10-15 |
| 10428238 | Resin composition, polyimide film and method for manufacturing polyimide film | Mao-Feng Hsu, SHOU-JUI HSIANG, NAN-KUN HUANG, YU-WEN KAO, CHIA-YIN TENG +1 more | 2019-10-01 |
| 10365430 | Method for manufacturing high frequency signal transmission structure and high frequency signal transmission structure obtained thereby | XIAN-QIN HU, FU-YUN SHEN, Feng Hu | 2019-07-30 |
| 10321561 | Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit board | XIAN-QIN HU | 2019-06-11 |
| 10299367 | Circuit board having conductive polymer | HSIAO-TING HSU | 2019-05-21 |
| 10278307 | Cooling plate and method for manufacturing thereof | XIAN-QIN HU, FU-YUN SHEN, HSIAO-TING HSU | 2019-04-30 |
| 10205487 | Wireless power consortium device and method for manufacturing the same | XIAN-QIN HU, FU-YUN SHEN | 2019-02-12 |
| 10117328 | Flexible circuit board and method for manufacturing same | Fu-Wei Zhong, Yi-Qiang Zhuang, Xin Zhang | 2018-10-30 |
| 10104771 | Method for making a circuit board | XIAN-QIN HU, FU-YUN SHEN, Wen-Zhu Wei | 2018-10-16 |