Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12369275 | Heat equalization plate | HSIAO-TING HSU, MING-JAAN HO | 2025-07-22 |
| 12320718 | Pressure sensing circuit board and method for manufacturing the same | HSIAO-TING HSU, MING-JAAN HO | 2025-06-03 |
| 12063752 | Methods of manufacturing circuit board and circuit board assembly | Wen-Zhu Wei, MING-JAAN HO, Hong Guo | 2024-08-13 |
| 12048084 | Covering film, and circuit board and manufacturing method | HSIAO-TING HSU, MING-JAAN HO, Katsumi Fujiwara, Fu-Wei Zhong | 2024-07-23 |
| 11979977 | Circuit board with heat dissipation structure and method for manufacturing same | HSIAO-TING HSU, Tao Liao, MING-JAAN HO, XIAN-QIN HU | 2024-05-07 |
| 11950357 | Circuit board for transmitting high-frequency signal and method for manufacturing the same | Hong Guo, HSIAO-TING HSU, MING-JAAN HO | 2024-04-02 |
| 11778752 | Circuit board with embedded electronic component and method for manufacturing the same | HSIAO-TING HSU, MING-JAAN HO | 2023-10-03 |
| 11765818 | Method for manufacturing transmission circuit board | Wen-Zhu Wei, MING-JAAN HO | 2023-09-19 |
| 11700685 | Method for manufacturing the same | XIAN-QIN HU | 2023-07-11 |
| 11672100 | Heat equalization plate and method for manufacturing the same | HSIAO-TING HSU, MING-JAAN HO | 2023-06-06 |
| 11665833 | Circuit board and manufacturing method thereof | MING-JAAN HO, XIAN-QIN HU, HSIAO-TING HSU, Yong-Chao Wei | 2023-05-30 |
| 11457532 | Method of manufacturing circuit board | MING-JAAN HO, HSIAO-TING HSU, Lin Gao | 2022-09-27 |
| 11380603 | Method for making a heat dissipation structure | Cong Lei, MING-JAAN HO, HSIAO-TING HSU | 2022-07-05 |
| 11297748 | Electromagnetic shielding film | MING-JAAN HO, HSIAO-TING HSU | 2022-04-05 |
| 11259405 | Transmission circuit board and method for manufacturing the same | Wen-Zhu Wei, MING-JAAN HO | 2022-02-22 |
| 11212922 | Circuit board and manufacturing method thereof | MING-JAAN HO, XIAN-QIN HU, HSIAO-TING HSU, Yong-Chao Wei | 2021-12-28 |
| 11197368 | High-frequency circuit board and method for manufacturing the same | XIAN-QIN HU | 2021-12-07 |
| 11134564 | Transparent PCB and method for manufacturing the same | HSIAO-TING HSU, MING-JAAN HO, LI-KUN LIU | 2021-09-28 |
| 10745595 | Resin composition, adhesive layer, and circuit board utilizing same | Cong Lei, MING-JAAN HO, HSIAO-TING HSU | 2020-08-18 |
| 10658265 | Heat dissipation structure, method for making the same, and electronic device having the same | Cong Lei, MING-JAAN HO, HSIAO-TING HSU | 2020-05-19 |
| 10660210 | Flexible circuit board | MING-JAAN HO, HSIAO-TING HSU | 2020-05-19 |
| 10575406 | Method of making flexible circuit board | MING-JAAN HO, HSIAO-TING HSU | 2020-02-25 |
| 10533811 | Heat dissipation device | XIAN-QIN HU, MING-JAAN HO | 2020-01-14 |
| 10365430 | Method for manufacturing high frequency signal transmission structure and high frequency signal transmission structure obtained thereby | XIAN-QIN HU, MING-JAAN HO, Feng Hu | 2019-07-30 |
| 10278307 | Cooling plate and method for manufacturing thereof | XIAN-QIN HU, MING-JAAN HO, HSIAO-TING HSU | 2019-04-30 |