Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380603 | Method for making a heat dissipation structure | FU-YUN SHEN, MING-JAAN HO, HSIAO-TING HSU | 2022-07-05 |
| 10923411 | Method for manufacturing an ultrathin heat dissipation structure | Ning Hou, Biao Li, MING-JAAN HO | 2021-02-16 |
| 10745595 | Resin composition, adhesive layer, and circuit board utilizing same | FU-YUN SHEN, MING-JAAN HO, HSIAO-TING HSU | 2020-08-18 |
| 10658265 | Heat dissipation structure, method for making the same, and electronic device having the same | FU-YUN SHEN, MING-JAAN HO, HSIAO-TING HSU | 2020-05-19 |
| 10448540 | Ultrathin heat dissipation structure | Ning Hou, Biao Li, MING-JAAN HO | 2019-10-15 |