Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11970591 | Resin composition, prepreg for printed circuit and metal-coated laminate | Yundong Meng | 2024-04-30 |
| 10513605 | Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same | Hui Li, Yongjing XU | 2019-12-24 |
| 10400099 | Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same | Hui Li, Yongjing XU | 2019-09-03 |
| 10343383 | Thermosetting resin composition and prepreg and laminated board prepared therefrom | Hui Li | 2019-07-09 |
| 10336875 | Halogen-free resin composition and prepreg and laminate prepared therefrom | Hui Li | 2019-07-02 |
| 10144824 | Halogen free resin composition and prepreg and laminated board prepared therefrom | Hui Li | 2018-12-04 |
| 9670362 | Thermoset resin composition, and prepreg and laminate for printed circuit board manufactured therefrom | Yundong Meng | 2017-06-06 |
| 8889816 | Method for preparing phosphorus-containing polyphenylene oxide resin with low molecular weight | Yundong Meng | 2014-11-18 |