Issued Patents All Time
Showing 76–100 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6090963 | Alkene ligand precursor and synthesis method | Wei-Wei Zhuang, Robert Barrowcliff, David R. Evans, Sheng Teng Hsu | 2000-07-18 |
| 6043164 | Method for transferring a multi-level photoresist pattern | Sheng Teng Hsu, Jer-Shen Maa, Bruce D. Ulrich, Chien-Hsiung Peng | 2000-03-28 |
| 6023102 | Low resistance contact between circuit metal levels | Sheng Teng Hsu | 2000-02-08 |
| 6020639 | Semiconductor wafer with removed CVD copper | Bruce D. Ulrich, Masato Kobayashi | 2000-02-01 |
| 6015918 | Allyl-derived precursor and synthesis method | Wei-Wei Zhuang, Greg Michael Stecker, David R. Evans, Sheng Teng Hsu | 2000-01-18 |
| 6002176 | Differential copper deposition on integrated circuit surfaces | Lawrence J. Charneski, Sheng Teng Hsu | 1999-12-14 |
| 5994571 | Substituted ethylene precursor and synthesis method | Wei-Wei Zhuang, Lawrence J. Charneski, David R. Evans, Sheng Teng Hsu | 1999-11-30 |
| 5948467 | Enhanced CVD copper adhesion by two-step deposition process | Lawrence J. Charneski, Masato Kobayashi | 1999-09-07 |
| 5945402 | Human relaxin formulation | David C. Cipolla, Steven J. Shire | 1999-08-31 |
| 5939334 | System and method of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides | Lawrence J. Charneski, David R. Evans, Sheng Teng Hsu | 1999-08-17 |
| 5936707 | Multi-level reticle system and method for forming multi-level resist profiles | Bruce D. Ulrich, David R. Evans | 1999-08-10 |
| 5918150 | Method for a chemical vapor deposition of copper on an ion prepared conductive surface | Jer-Shen Maa | 1999-06-29 |
| 5914202 | Method for forming a multi-level reticle | Bruce D. Ulrich, David R. Evans | 1999-06-22 |
| 5913144 | Oxidized diffusion barrier surface for the adherence of copper and method for same | Lawrence J. Charneski, Lynn R. Allen | 1999-06-15 |
| 5909637 | Copper adhesion to a diffusion barrier surface and method for same | Lawrence J. Charneski | 1999-06-01 |
| 5906910 | Multi-level photoresist profile method | Bruce D. Ulrich, David R. Evans | 1999-05-25 |
| 5904565 | Low resistance contact between integrated circuit metal levels and method for same | Sheng Teng Hsu | 1999-05-18 |
| 5900290 | Method of making low-k fluorinated amorphous carbon dielectric | Hongning Yang | 1999-05-04 |
| 5897379 | Low temperature system and method for CVD copper removal | Bruce D. Ulrich, Masato Kobayashi | 1999-04-27 |
| 5851367 | Differential copper deposition on integrated circuit surfaces and method for same | Lawrence J. Charneski, Sheng Teng Hsu | 1998-12-22 |
| 5821169 | Hard mask method for transferring a multi-level photoresist pattern | Chien-Hsiung Peng, Bruce D. Ulrich | 1998-10-13 |
| 5767301 | Precursor with (alkyloxy)(alkyl)-silylolefin ligand to deposit copper | Yoshihide Senzaki, Masato Kobayashi, Lawrence J. Charneski | 1998-06-16 |
| 5744192 | Method of using water vapor to increase the conductivity of cooper desposited with cu(hfac)TMVS | Yoshihide Senzaki, Masato Kobayashi, Lawrence J. Charneski, Sheng Teng Hsu | 1998-04-28 |
| 5589169 | Method and therapeutic compositions for the prevention of fibrin deposition or adhesions | Marjorie A. Mohler | 1996-12-31 |
| 5468687 | Method of making TA.sub.2 O.sub.5 thin film by low temperature ozone plasma annealing (oxidation) | Dan Carl, David M. Dobuzinsky, Son V. Nguyen | 1995-11-21 |