Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7759150 | Nanorod sensor with single-plane electrodes | Fengyan Zhang, Bruce D. Ulrich, Wei Pan, Sheng Teng Hsu | 2010-07-20 |
| 7696550 | Bipolar switching PCMO capacitor | Tingkai Li, Wei-Wei Zhuang, David R. Evans, Sheng Teng Hsu | 2010-04-13 |
| 7235407 | System and method for forming a bipolar switching PCMO film | Tingkai Li, Wei-Wei Zhuang, David R. Evans, Sheng Teng Hsu | 2007-06-26 |
| 7098101 | Method of forming PrxCa1−xMnO3 thin films having a PrMnO3/CaMnO3 super lattice structure using metalorganic chemical vapor deposition | Tingkai Li, Sheng Teng Hsu | 2006-08-29 |
| 6972239 | Low temperature MOCVD processes for fabrication of PrXCa1-xMnO3 thin films | Tingkai Li, Wei-Wei Zhuang, David R. Evans, Sheng Teng Hsu | 2005-12-06 |
| 6764537 | Copper metal precursor | Wei-Wei Zhuang, David R. Evans, Sheng Teng Hsu | 2004-07-20 |
| 6669870 | Substituted phenylethylene precursor synthesis method | Wei-Wei Zhuang, Tue Nguyen, David R. Evans, Sheng Teng Hsu | 2003-12-30 |
| 6645860 | Adhesion promotion method for CVD copper metallization in IC applications | Tue Nguyen, Gautam Bhandari | 2003-11-11 |
| 6596344 | Method of depositing a high-adhesive copper thin film on a metal nitride substrate | Wei-Wei Zhuang, David R. Evans, Sheng Teng Hsu | 2003-07-22 |
| 6555916 | Integrated circuit prepared by selectively cleaning copper substrates, in-situ, to remove copper oxides | Tue Nguyen, David R. Evans, Sheng Teng Hsu | 2003-04-29 |
| 6355562 | Adhesion promotion method for CVD copper metallization in IC applications | Tue Nguyen, Gautam Bhandari | 2002-03-12 |
| 6284652 | Adhesion promotion method for electro-chemical copper metallization in IC applications | Tuc Van NGUYEN, Gautam Bhandari | 2001-09-04 |
| 6284052 | In-situ method of cleaning a metal-organic chemical vapor deposition chamber | Tue Nguyen | 2001-09-04 |
| 6281377 | Substituted cycloalkene new copper precursors for chemical vapor deposition of copper metal thin films | Wei-Wei Zhuang, Tue Nguyen, David R. Evans, Sheng Teng Hsu | 2001-08-28 |
| 6281589 | System of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides | Tue Nguyen, David R. Evans, Sheng Teng Hsu | 2001-08-28 |
| 6245261 | Substituted phenylethylene precursor and synthesis method | Wei-Wei Zhuang, Tue Nguyen, David R. Evans, Sheng Teng Hsu | 2001-06-12 |
| 6218734 | Copper adhered to a diffusion barrier surface | Tue Nguyen | 2001-04-17 |
| 6204176 | Substituted phenylethylene precursor deposition method | Wei-Wei Zhuang, Sheng Teng Hsu | 2001-03-20 |
| 6090960 | Precursor with (methoxy) (methyl) silylolefin ligand to deposit copper and method same | Yoshihide Senzaki, Masato Kobayashi, Tue Nguyen | 2000-07-18 |
| 6002176 | Differential copper deposition on integrated circuit surfaces | Tue Nguyen, Sheng Teng Hsu | 1999-12-14 |
| 5994571 | Substituted ethylene precursor and synthesis method | Wei-Wei Zhuang, Tue Nguyen, David R. Evans, Sheng Teng Hsu | 1999-11-30 |
| 5948467 | Enhanced CVD copper adhesion by two-step deposition process | Tue Nguyen, Masato Kobayashi | 1999-09-07 |
| 5939334 | System and method of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides | Tue Nguyen, David R. Evans, Sheng Teng Hsu | 1999-08-17 |
| 5913144 | Oxidized diffusion barrier surface for the adherence of copper and method for same | Tue Nguyen, Lynn R. Allen | 1999-06-15 |
| 5909637 | Copper adhesion to a diffusion barrier surface and method for same | Tue Nguyen | 1999-06-01 |