Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5851367 | Differential copper deposition on integrated circuit surfaces and method for same | Tue Nguyen, Sheng Teng Hsu | 1998-12-22 |
| 5767301 | Precursor with (alkyloxy)(alkyl)-silylolefin ligand to deposit copper | Yoshihide Senzaki, Masato Kobayashi, Tue Nguyen | 1998-06-16 |
| 5744192 | Method of using water vapor to increase the conductivity of cooper desposited with cu(hfac)TMVS | Tue Nguyen, Yoshihide Senzaki, Masato Kobayashi, Sheng Teng Hsu | 1998-04-28 |