TN

Tuc Van NGUYEN

AC Advanced Technology & Materials Co.: 1 patents #255 of 410Top 65%
ST Sharp Microelectronics Technology: 1 patents #25 of 57Top 45%
📍 Vancouver, WA: #1,061 of 1,812 inventorsTop 60%
🗺 Washington: #48,111 of 76,902 inventorsTop 65%
Overall (All Time): #3,593,079 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6284652 Adhesion promotion method for electro-chemical copper metallization in IC applications Lawrence J. Charneski, Gautam Bhandari 2001-09-04