TN

Tue Nguyen

Sharp Kabushiki Kaisha: 24 patents #631 of 10,731Top 6%
SA Sharp Laboratories Of America: 23 patents #44 of 419Top 15%
TE Tegal: 21 patents #2 of 53Top 4%
SS Simplus Systems: 14 patents #1 of 3Top 35%
ST Sharp Microelectronics Technology: 12 patents #2 of 57Top 4%
Genentech: 5 patents #606 of 2,392Top 30%
AN Asm International N.V.: 5 patents #40 of 197Top 25%
IBM: 4 patents #21,733 of 70,183Top 35%
AC Advanced Technology & Materials Co.: 2 patents #161 of 410Top 40%
IN Intel: 1 patents #18,218 of 30,777Top 60%
📍 Fremont, CA: #69 of 9,298 inventorsTop 1%
🗺 California: #2,022 of 386,348 inventorsTop 1%
Overall (All Time): #13,040 of 4,157,543Top 1%
105
Patents All Time

Issued Patents All Time

Showing 51–75 of 105 patents

Patent #TitleCo-InventorsDate
6641672 Replaceable shielding apparatus 2003-11-04
6630396 Use of a silicon carbide adhesion promoter layer to enhance the adhesion of silicon nitride to low-k fluorinated amorphous carbon Hongning Yang 2003-10-07
6610169 Semiconductor processing system and method Tai Dung Nguyen, Craig Bercaw 2003-08-26
6609632 Removable lid and floating pivot Craig Bercaw 2003-08-26
6572707 Vaporizer for sensitive precursors 2003-06-03
6572706 Integrated precursor delivery system Craig Bercaw 2003-06-03
6565661 High flow conductance and high thermal conductance showerhead system and method 2003-05-20
6555916 Integrated circuit prepared by selectively cleaning copper substrates, in-situ, to remove copper oxides Lawrence J. Charneski, David R. Evans, Sheng Teng Hsu 2003-04-29
6495449 Multilayered diffusion barrier structure for improving adhesion property 2002-12-17
6488272 Liquid delivery system emulsifier 2002-12-03
6444039 Three-dimensional showerhead apparatus 2002-09-03
6440878 Method to enhance the adhesion of silicon nitride to low-k fluorinated amorphous carbon using a silicon carbide adhesion promoter layer Hongning Yang 2002-08-27
6440219 Replaceable shielding apparatus 2002-08-27
6355562 Adhesion promotion method for CVD copper metallization in IC applications Lawrence J. Charneski, Gautam Bhandari 2002-03-12
6284052 In-situ method of cleaning a metal-organic chemical vapor deposition chamber Lawrence J. Charneski 2001-09-04
6281377 Substituted cycloalkene new copper precursors for chemical vapor deposition of copper metal thin films Wei-Wei Zhuang, Lawrence J. Charneski, David R. Evans, Sheng Teng Hsu 2001-08-28
6281589 System of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides Lawrence J. Charneski, David R. Evans, Sheng Teng Hsu 2001-08-28
6274421 Method of making metal gate sub-micron MOS transistor Sheng Teng Hsu, David R. Evans 2001-08-14
6245261 Substituted phenylethylene precursor and synthesis method Wei-Wei Zhuang, Lawrence J. Charneski, David R. Evans, Sheng Teng Hsu 2001-06-12
6221166 Multi-thermal zone shielding apparatus Craig Bercaw 2001-04-24
6218734 Copper adhered to a diffusion barrier surface Lawrence J. Charneski 2001-04-17
6184157 Stress-loaded film and method for same Sheng Teng Hsu, Hongning Yang, David R. Evans, Yanjun Ma 2001-02-06
6111619 Method of forming polycrystalline silicon TFTs with TiN/Cu/TiN interconnections for a liquid crystal display pixel array Shusheng He 2000-08-29
6090781 Stabilizing formulation for NGF Linda DeYoung, Xanthe M. Lam, Michael F. Powell 2000-07-18
6090960 Precursor with (methoxy) (methyl) silylolefin ligand to deposit copper and method same Yoshihide Senzaki, Lawrence J. Charneski, Masato Kobayashi 2000-07-18