Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398420 | Semiconductor package having core member and redistribution substrate | Kyungdon Mun, Myungsam Kang, Yieok Kwon, Jeongseok Kim, Gongje Lee +1 more | 2022-07-26 |
| 11387225 | Fan-out type semiconductor package and method of manufacturing the same | Myungsam Kang, Yongjin Park | 2022-07-12 |
| 11329014 | Semiconductor package | Myungsam Kang, Changbae Lee, Bongju Cho, Younggwan Ko, Yongkoon Lee +1 more | 2022-05-10 |