Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9312213 | Bump structures having an extension | Moon Gi Cho, Sun-Hee Park, Hwan-Sik Lim | 2016-04-12 |
| 9299631 | Stack-type semiconductor package | Ae-Nee Jang | 2016-03-29 |
| 9281235 | Semiconductor packages and methods of forming the same | Taehoon Kim, Jongho Lee, Chul-Yong Jang | 2016-03-08 |
| 9245816 | Semiconductor package and method of manufacturing the semiconductor package | Chul-Yong Jang, Ae-Nee Jang | 2016-01-26 |
| 9159705 | Semiconductor chip connecting semiconductor package | Chul-Yong Jang, Ae-Nee Jang | 2015-10-13 |
| 9024448 | Lower semiconductor molding die, semiconductor package, and method of manufacturing the semiconductor package | Jae Gwon Jang, Ae-Nee Jang | 2015-05-05 |
| 8970046 | Semiconductor packages and methods of forming the same | Taehoon Kim, Jongho Lee, Chul-Yong Jang | 2015-03-03 |
| 8884446 | Semiconductor packages | Seong-Ho Shin, Jae Gwon Jang, Jong Ho Lee | 2014-11-11 |
| 8815731 | Semiconductor package and method of fabricating the same | Hyeongseob Kim, Jongho Lee, Eunchul Ahn | 2014-08-26 |
| 8354744 | Stacked semiconductor package having reduced height | Byung Woo Lee, Eun-Chul Ahn | 2013-01-15 |
| 8053881 | Semiconductor package and method for manufacturing the same | Jongho Lee, Cheul-Joong Youn, Eunchul Ahn | 2011-11-08 |
| 7759795 | Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same | Young-shin Choi, Jong Gi LEE, Kun-dae Yeom, Chul-Yong Jang, Hyun Jong Woo | 2010-07-20 |
| 7745907 | Semiconductor package including connector disposed in troughhole | Jong Ho Lee | 2010-06-29 |
| D582263 | Package | Steffen Smith, Aileen Storer | 2008-12-09 |