Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8309399 | Power semiconductor module and method of manufacturing the same | Shan Gao, Tae Hyun Kim, Ju Pyo Hong, Bum Sik Jang, Ji Hyun Park | 2012-11-13 |
| 8304279 | Light emitting diode package having anodized insulation layer and fabrication method therefor | Young Ki Lee, Sang Hyun Shin | 2012-11-06 |
| 8299692 | Light emitting device package and method of manufacturing the same | Young Ki Lee, Hyung Jin Jeon, Sang Hyun Shin | 2012-10-30 |
| 8242371 | Heat dissipating circuit board and method of manufacturing the same | Hye Sook Shin, Shan Gao, Chang Hyun Lim, Tae Hyun Kim, Young Ki Lee | 2012-08-14 |
| 8198543 | Rigid-flexible circuit board and method of manufacturing the same | Jung Eun Kang, Tae Hoon Kim, Young Ki Lee, Hye Sook Shin, Chang Hyun Lim | 2012-06-12 |
| 8064215 | Semiconductor chip package and printed circuit board | Yul Kyo Chung, Sung Yi, Soon Gyu Yim, Jin Gu Kim, Young Do Kweon | 2011-11-22 |
| 8058722 | Power semiconductor module and method of manufacturing the same | Shan Gao, Tae Hyun Kim, Ju Pyo Hong, Bum Sik Jang, Ji Hyun Park | 2011-11-15 |
| 8058781 | Anodized metal substrate module | Young Ki Lee, Young Bok YOON, Sang Hyun Shin | 2011-11-15 |
| 8047693 | Cooling device for light emitting device package of vibration generating machine and head lamp for vibration generating machine | Young Ki Lee, Sang Hyun Shin, Shan Gao, Jong Woon Kim | 2011-11-01 |
| 8030762 | Light emitting diode package having anodized insulation layer and fabrication method therefor | Young Ki Lee, Sang Hyun Shin | 2011-10-04 |
| 8017437 | Method for manufacturing a semiconductor package | Do Jae Yoo, Young Do Kweon, Bum Sik Jang, Tae Sung Jeong | 2011-09-13 |
| 8012778 | LED package and fabricating method thereof | Yong Suk Kim, Young Soo Oh, Hyoung Ho Kim, Taek Jung Lee | 2011-09-06 |
| 7998879 | Insulation structure for high temperature conditions and manufacturing method thereof | Young Ki Lee, Sang Hyun Shin | 2011-08-16 |
| 7960806 | Sub-mount, light emitting diode package and manufacturing method thereof | Young Ki Lee, Hyung Jin Jeon, Sang Hyun Shin | 2011-06-14 |
| 7911043 | Wafer level device package with sealing line having electroconductive pattern and method of packaging the same | Ju Pyo Hong, Tae Hoon Kim, Job Ha, Seung Wook Park | 2011-03-22 |
| 7875497 | Method of manufacturing a semiconductor package | Do Jae Yoo, Young Do Kweon, Bum Sik Jang, Tae Sung Jeong | 2011-01-25 |
| 7875983 | Semiconductor package | Do Jae Yoo, Young Do Kweon, Bum Sik Jang, Tae Sung Jeong | 2011-01-25 |
| 7863640 | Light emitting diode package, circuit board for light emitting diode package and method of manufacturing the same | Sang Hyun Shin, Young Ki Lee | 2011-01-04 |
| 7816156 | Light emitting diode package and fabrication method thereof | Sang Hyun Choi, Woong Hwang, Ho Joon Park, Sung Jun Lee, Chang Hyun Lim | 2010-10-19 |
| 7696525 | Surface mounting device-type light emitting diode | Yong Sik Kim, Hyun-Ho Kim | 2010-04-13 |
| 7649208 | Light emitting diode package including monitoring photodiode | Sung Jun Lee, Woong Hwang, Ho Joon Park, Sang Hyun Choi, Chang Hyun Lim | 2010-01-19 |
| 7642656 | Semiconductor package and method for manufacturing thereof | Do Jae Yoo, Young Do Kweon, Burn-Sik Jang, Tae Sung Jeong | 2010-01-05 |
| 7582496 | LED package using Si substrate and fabricating method thereof | Sung Jun Lee, Woong Hwang, Sang Hyun Choi, Chang Hyun Lim, Ho Joon Park | 2009-09-01 |
| 7566912 | Light emitting diode package | Young Ki Lee, Seon Goo Lee, Sang Hyun Shin | 2009-07-28 |
| 7547923 | Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof | Sang Hyun Shin, Young Ki Lee | 2009-06-16 |