Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227835 | Semiconductor package | Jina Jeung, Sunghyun Kim | 2022-01-18 |
| 10854561 | Semiconductor package | Mi Jin Park, Ji Eun PARK | 2020-12-01 |
| 10811358 | Hybrid interposer and semiconductor package including the same | Sung Hyun Kim, Ji Na Jeung | 2020-10-20 |
| 10559541 | Semiconductor package | Mi Jin Park, Ji Eun PARK | 2020-02-11 |
| 9455207 | All-in-one power semiconductor module | Kwang Soo Kim, Si Joong Yang, Bum Seok Suh, Young Hoon Kwak | 2016-09-27 |
| 9099451 | Power module package and method of manufacturing the same | — | 2015-08-04 |
| D717253 | Semiconductor device | Eun Jung Jo, Jin Suk Son, Jae Hoon Park, Chang Seob Hong, Joon Hyung Cho +3 more | 2014-11-11 |
| D717254 | Semiconductor device | Eun Jung Jo, Kee Ju Um, Sun Woo Yun, Chang Seob Hong, Suk Ho Kee +3 more | 2014-11-11 |
| D717256 | Semiconductor device | Young Ho Sohn, Jang Man Kim, Sung Man Pang, Sun Woo Yun, Suk Ho Lee +3 more | 2014-11-11 |
| 7911043 | Wafer level device package with sealing line having electroconductive pattern and method of packaging the same | Ju Pyo Hong, Seog Moon Choi, Tae Hoon Kim, Seung Wook Park | 2011-03-22 |