Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7521810 | Chip stack package and manufacturing method thereof | Pyoung-Wan Kim | 2009-04-21 |
| 7485955 | Semiconductor package having step type die and method for manufacturing the same | Seok Goh, Jin Ho Kim, Tae-Gyeong Chung, Yong Jae Lee | 2009-02-03 |
| 7371675 | Method and apparatus for bonding a wire | Sang-Ho An, Sun-Mo Yang | 2008-05-13 |
| 7368811 | Multi-chip package and method for manufacturing the same | Tae-Gyeong Chung, Sang-Ho An | 2008-05-06 |
| 7282431 | Single chip and stack-type chip semiconductor package and method of manufacturing the same | Sung Hwan Yoon | 2007-10-16 |
| 7176558 | Single chip and stack-type chip semiconductor package and method of manufacturing the same | Sung Hwan Yoon | 2007-02-13 |
| 7109065 | Bumped chip carrier package using lead frame and method for manufacturing the same | Sang-Ho Ahn | 2006-09-19 |
| 7098407 | Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate | Jin Ho Kim, Hee-Kook Choi | 2006-08-29 |
| 7067413 | Wire bonding method, semiconductor chip, and semiconductor package | Jin Ho Kim, Sang-Yeop Lee | 2006-06-27 |
| 7030489 | Multi-chip module having bonding wires and method of fabricating the same | Hee-Kook Choi, Sang-Ho An, Sang-Yeop Lee | 2006-04-18 |
| 6977439 | Semiconductor chip stack structure | Sang-Ho Ahn, Sun-Mo Yang | 2005-12-20 |
| 6818976 | Bumped chip carrier package using lead frame | Sang-Ho Ahn | 2004-11-16 |
| 6448661 | Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof | Hyeong-Seob Kim, Sa-Yoon Kang, Myung-Kee Chung, Kwan-Jai Lee | 2002-09-10 |