Issued Patents All Time
Showing 151–175 of 203 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9401361 | Semiconductor arrangement having first semiconductor device over first shallow well having first conductivity type and second semiconductor device over second shallow well having second conductivity type and formation thereof | Cheng-Wei Luo | 2016-07-26 |
| 9385246 | Differential MOSCAP device | Yu-Ling Lin, Chin-Wei Kuo, Min-Chie Jeng | 2016-07-05 |
| 9373434 | Inductor assembly and method of using same | Shyh-An Chi | 2016-06-21 |
| 9373673 | 3-D inductor and transformer | Chin-Wei Kuo, Hsien-Pin Hu, Sally Liu, Ming-Fa Chen, Jhe-Ching Lu | 2016-06-21 |
| 9362613 | Bond wire antenna | — | 2016-06-07 |
| 9337181 | Semiconductor device and method of manufacturing same | Yuh-Sheng Jean, Ta-Hsun Yeh | 2016-05-10 |
| 9331013 | Integrated capacitor | Cheng-Wei Luo, Jun Cheng Huang, Chin-Wei Kuo, Min-Chie Jeng | 2016-05-03 |
| 9330830 | Structure and method for a transformer with magnetic features | Yu-Ling Lin, Ying-Ta Lu, Huan-Neng Chen, Ho-Hsiang Chen | 2016-05-03 |
| 9324720 | Meander line resistor structure | Yu-Ling Lin | 2016-04-26 |
| 9312221 | Variable capacitance devices | Cheng-Wei Luo | 2016-04-12 |
| 9305808 | Methods and apparatus of packaging with interposers | Chung-Yu Lu, Hsien-Pin Hu, Tzuan-Horng Liu, Shih-Wen Huang, Shang-Yun Hou +1 more | 2016-04-05 |
| 9202785 | Three dimensional integrated circuit capacitor having vias | Cheng-Wei Luo | 2015-12-01 |
| 9203146 | Antenna using through-silicon via | Jhe-Ching Lu, Yu-Ling Lin, Chin-Wei Kuo, Min-Chie Jeng | 2015-12-01 |
| 9202866 | Semiconductor device and formation thereof | Cheng-Wei Luo | 2015-12-01 |
| 9184721 | Signal-transmission-line structure and electronic device using the same | Yuh-Sheng Jean, Ta-Hsun Yeh | 2015-11-10 |
| 9171798 | Methods and apparatus for transmission lines in packages | Yu-Ling Lin, Chin-Wei Kuo, Min-Chie Jeng | 2015-10-27 |
| 9159718 | Switched capacitor structure | Ying-Ta Lu, Ho-Hsiang Chen, Chewn-Pu Jou | 2015-10-13 |
| 9159728 | Meander line resistor structure | Yu-Ling Lin | 2015-10-13 |
| 9121891 | Apparatus and methods for de-embedding through substrate vias | Min-Chie Jeng, Victor Chih Yuan Chang, Chin-Wei Kuo, Yu-Ling Lin | 2015-09-01 |
| 9103884 | De-embedding on-wafer devices | Yu-Ling Lin, Chin-Wei Kuo, Ho-Hsiang Chen, Sa-Lly Liu | 2015-08-11 |
| 9098660 | Metal interconnect modeling | — | 2015-08-04 |
| 9087838 | Structure and method for a high-K transformer with capacitive coupling | Yu-Ling Lin, Chin-Wei Kuo, Ho-Hsiang Chen, Min-Chie Jeng | 2015-07-21 |
| 9087840 | Slot-shielded coplanar strip-line compatible with CMOS processes | Yu-Ling Lin, Ho-Hsiang Chen, Chin-Wei Kuo, Chewn-Pu Jou | 2015-07-21 |
| 9064705 | Methods and apparatus of packaging with interposers | Chung-Yu Lu, Hsien-Pin Hu, Tzuan-Horng Liu, Shih-Wen Huang, Shang-Yun Hou +1 more | 2015-06-23 |
| 9059026 | 3-D inductor and transformer | Chin-Wei Kuo, Hsien-Pin Hu, Sally Liu, Ming-Fa Chen, Jhe-Ching Lu | 2015-06-16 |