XL

Xia Li

QU Qualcomm: 220 patents #101 of 12,104Top 1%
AM AMD: 12 patents #986 of 9,279Top 15%
Apple: 8 patents #3,815 of 18,612Top 25%
MC Monell Chemical Senses Center: 6 patents #3 of 82Top 4%
GZ Gree Electric Appliances, Inc. Of Zhuhai: 5 patents #87 of 1,089Top 8%
IBM: 5 patents #18,733 of 70,183Top 30%
Honda Motor Co.: 5 patents #4,418 of 21,052Top 25%
VE Verizon: 4 patents #1,190 of 6,226Top 20%
CM Chartered Semiconductor Manufacturing: 4 patents #148 of 840Top 20%
MC Mc10: 4 patents #20 of 65Top 35%
UN Unknown: 4 patents #4,220 of 83,584Top 6%
WC Wuhan Tianma Microelectronics Co.: 4 patents #86 of 395Top 25%
SI Sionyx: 3 patents #13 of 20Top 65%
UU Utah State University: 3 patents #42 of 289Top 15%
Huawei: 3 patents #4,041 of 15,535Top 30%
SU Shanghai University: 3 patents #20 of 195Top 15%
YC Yanfeng Adent Seating Co.: 2 patents #2 of 21Top 10%
GE: 2 patents #13,562 of 36,430Top 40%
PL Petrochina Company Limited: 2 patents #138 of 890Top 20%
ZT Zte: 1 patents #1,433 of 3,593Top 40%
Google: 1 patents #14,769 of 22,993Top 65%
MT Macau University Of Science And Technology: 1 patents #70 of 165Top 45%
PA Panasonic: 1 patents #13,264 of 21,108Top 65%
NU Northeast Electric Power University: 1 patents #15 of 68Top 25%
JT Jiangsu University Of Science And Technology: 1 patents #53 of 215Top 25%
QU Qorvo Us: 1 patents #255 of 457Top 60%
SC Shanghai Tianma Am-Oled Co.: 1 patents #137 of 214Top 65%
ST South China University Of Technology: 1 patents #245 of 947Top 30%
GT Guangdong University Of Petrochemical Technology: 1 patents #13 of 61Top 25%
XC Xiamen Tianma Micro-Electronics Co.: 1 patents #179 of 360Top 50%
YC Yanfeng International Seating Systems Co.: 1 patents #2 of 8Top 25%
📍 San Jose, CA: #22 of 32,062 inventorsTop 1%
🗺 California: #194 of 386,348 inventorsTop 1%
Overall (All Time): #1,079 of 4,157,543Top 1%
322
Patents All Time

Issued Patents All Time

Showing 301–322 of 322 patents

Patent #TitleCo-InventorsDate
7781231 Method of forming a magnetic tunnel junction device 2010-08-24
7776623 System and method to fabricate magnetic random access memory Seung H. Kang, Xiaochun Zhu 2010-08-17
7579197 Method of forming a magnetic tunnel junction structure 2009-08-25
7541158 Taste receptors of the T1R family from domestic dog Weihua Li, Joseph G. Brand 2009-06-02
7527944 Taste receptors of the T1R family from domestic cat Weihua Li, Danielle R. Reed, Alexander Bachmanov, Joseph G. Brand 2009-05-05
7029595 Selective etch for uniform metal trace exposure and milling using focused ion beam system Eugene A. Delenia, Rosalinda M. Ring 2006-04-18
6677169 Method and system for backside device analysis on a ball grid array package 2004-01-13
6531380 Method of fabricating T-shaped recessed polysilicon gate transistors Chock Hing Gan 2003-03-11
6521486 Method and system to reduce switching signal noise on a device and a device as result thereof Reid T. Hirata, Michael Coiner 2003-02-18
6517666 Automatic decapsulation system utilizing an integrated spacer/protection plate Jose Hulog, Mohammad Massoodi 2003-02-11
6458717 Methods of forming ultra-thin buffer oxide layers for gate dielectrics James Yong Meng Lee, Yunqzang Zhang 2002-10-01
6422611 Contractible joint device for metal conduit Jiesheng Jin, Yushi Zhou, Yuefang Liu, Chicheng Luo, Gengwu LI +10 more 2002-07-23
6409878 Automatic decapsulation system utilizing an acid resistant, high heat endurance and flexible sheet coupled to a rubber gasket and a method of use Joseph Vu, Mohammad Massoodi, Jose Hulog 2002-06-25
6324756 Method and system for sealing the edge of a PBGA package Ranji Gannamani 2001-12-04
6309933 Method of fabricating T-shaped recessed polysilicon gate transistors Chock Hing Gan 2001-10-30
6306741 Method of patterning gate electrodes with high K gate dielectrics James Yong Meng Lee, Yun Zhang 2001-10-23
6262430 Integrated system for frontside navigation and access of multi-layer integrated circuits 2001-07-17
6241907 Method and system for providing a package for decapsulating a chip-scale package Ranjit Gannamani 2001-06-05
6171944 Method for bringing up lower level metal nodes of multi-layered integrated circuits for signal acquisition Glen Gilfeather 2001-01-09
6168960 Backside device deprocessing of a flip-chip multi-layer integrated circuit 2001-01-02
6147399 Backside exposure of desired nodes in a multi-layer integrated circuit Daniel Yim 2000-11-14
6069079 Exposure of desired node in a multi-layer integrated circuit using FIB and RIE 2000-05-30