Issued Patents All Time
Showing 76–100 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425761 | High pass filters and low pass filters using through glass via technology | Chengjie Zuo, Jonghae Kim, Changhan Hobie Yun, Daeik Daniel Kim, Je-Hsiung Lan +2 more | 2016-08-23 |
| 9384883 | Nested through glass via transformer | Daeik Daniel Kim, Jonghae Kim, Chengjie Zuo, Changhan Hobie Yun | 2016-07-05 |
| 9379802 | Radio frequency switch for diversity receiver | Chengjie Zuo, Changhan Hobie Yun, Chi Shun Lo, Jonghae Kim | 2016-06-28 |
| 9379686 | Resonator with a staggered electrode configuration | Changhan Hobie Yun, Chengjie Zuo, Jonghae Kim, Daeik Daniel Kim, Rick A. Wilcox | 2016-06-28 |
| 9368564 | 3D pillar inductor | Chengjie Zuo, Jonghae Kim, Daeik Daniel Kim, Changhan Hobie Yun | 2016-06-14 |
| 9368566 | Package on package (PoP) integrated device comprising a capacitor in a substrate | Jong-Hoon Lee, Young Kyu Song, Daeik Daniel Kim, Jung Ho Yoon, Uei-Ming Jow +3 more | 2016-06-14 |
| 9370103 | Low package parasitic inductance using a thru-substrate interposer | Changhan Hobie Yun, Chengjie Zuo, Jonghae Kim, Daeik Daniel Kim | 2016-06-14 |
| 9362218 | Integrated passive device (IPD) on substrate | Daeik Daniel Kim, Young Kyu Song, Changhan Hobie Yun, Chengjie Zuo, Jonghae Kim +2 more | 2016-06-07 |
| 9355967 | Stress compensation patterning | Daeik Daniel Kim, Je-Hsiung Lan, Chengjie Zuo, Jonghae Kim, Changhan Hobie Yun | 2016-05-31 |
| 9343403 | Stress mitigation structure for wafer warpage reduction | Je-Hsiung Lan, David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun +3 more | 2016-05-17 |
| 9343399 | Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology | Je-Hsiung Lan, Chengjie Zuo, Changhan Hobie Yun, Jonghae Kim, Daeik Daniel Kim +2 more | 2016-05-17 |
| 9331666 | Composite dilation mode resonators | Chengjie Zuo, Jonghae Kim, Changhan Hobie Yun, Sang-June Park, Philip Jason Stephanou +4 more | 2016-05-03 |
| 9324779 | Toroid inductor in an integrated device | Young Kyu Song, Daeik Daniel Kim, Jonghae Kim, Xiaonan Zhang, Ryan David Lane +2 more | 2016-04-26 |
| 9275786 | Superposed structure 3D orthogonal through substrate inductor | David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Robert Paul Mikulka +1 more | 2016-03-01 |
| 9270254 | Cross-sectional dilation mode resonators and resonator-based ladder filters | Chengjie Zuo, Changhan Hobie Yun, Chi Shun Lo, Wesley Nathaniel Allen, Jonghae Kim +1 more | 2016-02-23 |
| 9264013 | Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods | Chengjie Zuo, Jonghae Kim, Daeik Daniel Kim, Changhan Hobie Yun, Je-Hsiung Lan +2 more | 2016-02-16 |
| 9203373 | Diplexer design using through glass via technology | Chengjie Zuo, Jonghae Kim, Je-Hsiung Lan, Daeik Daniel Kim, Changhan Hobie Yun +5 more | 2015-12-01 |
| 9202789 | Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package | Daeik Daniel Kim, Jonghae Kim, Matthew Michael Nowak, Chengjie Zuo, Changhan Hobie Yun +2 more | 2015-12-01 |
| 9136574 | Compact 3-D coplanar transmission lines | Daeik Daniel Kim, David Francis Berdy, Jonghae Kim, Chengjie Zuo, Changhan Hobie Yun +2 more | 2015-09-15 |
| 9101068 | Two-stage power delivery architecture | Changhan Hobie Yun, Francesco Carobolante, Chengjie Zuo, Jonghae Kim, Lawrence D. Smith +1 more | 2015-08-04 |
| 9099986 | Cross-sectional dilation mode resonators | Chengjie Zuo, Changhan Hobie Yun, Chi Shun Lo, Wesley Nathaniel Allen, Jonghae Kim | 2015-08-04 |
| 9008602 | Radio frequency switch for diversity receiver | Chengjie Zuo, Changhan Hobie Yun, Chi Shun Lo, Jonghae Kim | 2015-04-14 |
| 9001031 | Complex passive design with special via implementation | Chi Shun Lo, Je-Hsiung Lan, Robert Paul Mikulka, Chengjie Zuo, Changhan Hobie Yun +1 more | 2015-04-07 |
| 8970516 | Integrated passives and power amplifier | Justin Phelps Black, Ravindra V. Shenoy, Evgeni Gousev, Aristotele Hadjichristos, Thomas Andrew Myers +3 more | 2015-03-03 |
| 8907450 | Metal-semiconductor wafer bonding for high-Q devices | Changhan Hobie Yun, Chengjie Zuo, Chi Shun Lo, Jonghae Kim | 2014-12-09 |